6 Layer HDI PCB FR4 Circuit Boards Pcb Gold Fingers
PCB Process Kugona
| Aihwa. | Project | Technical zviratidzo |
| 1 | Layer | 1-60 (mutsetse) |
| 2 | Maximum processing area | 545 x 622 mm |
| 3 | Minimumboard thickness | 4(layer)0.40mm |
| 6(layer) 0.60mm | ||
| 8(mutsetse) 0.8mm | ||
| 10(layer)1.0mm | ||
| 4 | Minimum line width | 0.0762mm |
| 5 | Minimum spacing | 0.0762mm |
| 6 | Minimum mechanical aperture | 0.15mm |
| 7 | Gomba rusvingo rwemhangura ukobvu | 0.015mm |
| 8 | Metallized aperture tolerance | ± 0.05mm |
| 9 | Non-metallized aperture kushivirira | ± 0.025mm |
| 10 | Gomba kushivirira | ± 0.05mm |
| 11 | Dimensional kushivirira | ± 0.076mm |
| 12 | Minimum solder zambuko | 0.08mm |
| 13 | Insulation resistance | 1E+12Ω (yakajairika) |
| 14 | Plate ukobvu ratio | 1:10 |
| 15 | Thermal shock | 288 ℃ (4 nguva mumasekonzi gumi) |
| 16 | Yakakanganiswa uye yakakotama | ≤0.7% |
| 17 | Anti-magetsi simba | ＞1.3KV/mm |
| 18 | Anti-kubvisa simba | 1.4N/mm |
| 19 | Solder ramba kuoma | ≥6H |
| 20 | Flame retadancy | 94V-0 |
| 21 | Impedance control | ±5% |
Isu tinoita 6 layer HDI PCB ine makore gumi nemashanu ruzivo nehunyanzvi hwedu
4 layer Flex-Rigid Boards
8 layer Rigid-Flex PCBs
8 layer HDI Yakadhindwa Circuit Boards
Kuedza uye Kuongorora Equipment
Microscope Testing
Kuongorora kweAOI
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Yedu 6 layer HDI PCB Service
. Ipa rubatsiro rwehunyanzvi Pre-kutengesa uye mushure-kutengesa;
. Tsika anosvika makumi mana akaturikidzana, 1-2days Kurumidza kutendeuka yakavimbika prototyping, Component procurement, SMT Assembly;
. Inobata kune ese ari maviri Medical Device, Industrial Control, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications etc..
. Zvikwata zvedu zvemainjiniya nevatsvaguri vakazvipira kuzadzisa zvaunoda nehungwaru uye nehunyanzvi.
6 layer HDI PCB chaiyo application muMotokari
1. ADAS (Advanced Driver Assistance System): ADAS masisitimu anovimba nemasensi akawanda akadai semakamera, radars, uye lidars kubatsira vatyairi mukufamba uye kudzivirira kudhumhana. A 6-layer HDI PCB inoshandiswa muADAS modules kuti igare yakakwirira-density sensor connections uye ive nechokwadi chekufambisa kwechiratidzo chechokwadi chekuonekwa kwechinhu uye kunyevera mutyairi.
2. Infotainment system: The infotainment system mumotokari dzemazuva ano inobatanidza mabasa akasiyana-siyana akadai se GPS navigation, multimedia playback, nzira dzekubatanidza uye nzvimbo dzekukurukurirana. Iyo 6-layer HDI PCB inogonesa kubatanidzwa kwekombuta yezvikamu, zvinongedzo uye nzvimbo dzepakati, kuve nechokwadi chekukurukurirana kwakanaka, kutonga kwakavimbika uye kuwedzeredzwa kwemushandisi ruzivo.
3. Injini Yekudzora Injini (ECU): Injini inodzora unit ine basa rekutarisa uye kutonga akasiyana einjini mabasa akadai sejekiseni remafuta, nguva yekudzima, uye kutonga kwekuburitsa. Iyo 6-layer HDI PCB inobatsira kugarisa yakaoma kutenderera uye yakakwirira-kumhanya kutaurirana pakati peinjini sensors uye actuators, kuve nechokwadi chekutonga kweinjini uye kushanda zvakanaka.
4. Electronic Stability Control (ESC): Iyo ESC system inowedzera kugadzikana kwemotokari uye kuchengeteka nekuenderera mberi nekutarisa uye kugadzirisa yega vhiri braking uye injini torque. Iyo 6-layer HDI PCB inoita basa rakakosha muESC module, kufambisa kubatanidzwa kwe microcontrollers, sensors, uye actuators yechaiyo-nguva yedata data uye kutonga chaiko.
5. Powertrain: The Powertrain Control Unit (PCU) inogadzirisa kushanda kwejini, kutumira uye drivetrain kuitira kushanda kwakakwana uye kubudirira. Iyo 6-layer HDI PCB inobatanidza zvakasiyana-siyana masimba ekutonga masimba, tembiricha sensors uye yekutaurirana nzvimbo, kuve nechokwadi chekufambisa kwesimba kwakaringana, kuchinjanisa data kwakavimbika uye kutonga kunoshanda kwemafuta.
6. Battery Management System (BMS): BMS ine basa rekutarisa uye kutonga kushanda, kubhadharisa uye kuchengetedza bhatiri remotokari. Iyo 6-layer HDI PCB inogonesa compact dhizaini uye kubatanidzwa kweBMS zvikamu, zvinosanganisira bhatiri yekutarisa ICs, tembiricha sensors, ma sensors azvino, uye nzvimbo dzekutaurirana, kuve nechokwadi chekutonga kwebhatiri uye kuwedzera hupenyu hwebhatiri.
Sei 6 layer HDI PCB inovandudza tekinoroji muMotokari?
1. Miniaturization: 6-layer HDI PCB inobvumira kuiswa kwechikamu chepamusoro-density, nokudaro nekuona miniaturization yemagetsi emagetsi. Izvi zvakakosha muindasitiri yemotokari umo nzvimbo inowanzoganhurwa. Nekudzikisira saizi yePCB, vagadziri vanogona kugadzira mota diki, dzakareruka uye dzine compact mota.
2. Kuvandudza chiratidzo chekutendeseka: HDI teknolojia inoderedza kureba kwechiratidzo chekutsvaga uye inopa zviri nani impedance control.
Izvi zvinovandudza kunaka kwechiratidzo, zvinoderedza ruzha uye zvinowedzera kutendeseka kwechiratidzo. Kuve nechokwadi chekuita kwechiratidzo chekuvimbika kwakakosha mukushandisa kwemotokari uko kufambiswa kwedata uye kutaurirana kwakakosha.
3. Kuvandudzwa kwekushanda: Zvimwe zvikamu mu6-layer HDI PCB zvinopa nzvimbo yakawanda yekufambisa uye nzira dzekubatanidza, zvichiita kuti kuwedzere kushanda. Mota zvino dzinobatanidza mabasa akasiyana-siyana emagetsi, akadai seyepamusoro mutyairi rubatsiro masisitimu (ADAS), infotainment masisitimu uye injini yekudzora zvikamu. Kushandiswa kwe6-layer HDI PCB inofambisa kubatanidzwa kweaya mabasa akaoma.
4. High-speed data transmission: Zvirongwa zvemotokari, zvakadai semafambisirwo ekufambisa mberi uye kutaurirana kwepakati-motokari, inoda kukurumidza kwekufambisa data. Iyo 6-layer HDI PCB inotsigira yakakwirira-frequency application yekukurumidza uye inoshanda zvakanyanya kutapurirana data. Izvi zvakakosha pakuita-chaiyo-nguva yekuita sarudzo, kuvandudza kuchengetedzwa uye kuita.
5. Kuvimbika kwakawedzerwa: HDI teknolojia inoshandisa micro-vias kupa hutano huri nani hwemagetsi paunenge uchitora nzvimbo shoma.
Aya madiki vias anobatsira kuvandudza kuvimbika nekudzikisa njodzi yechiratidzo che crosstalk uye impedance mismatch. Mumagetsi emotokari uko kuvimbika kwakakosha, HDI PCBs inova nechokwadi chekubatana kwakasimba uye kwakasimba.
6. Thermal management: Nekuwedzera kuoma uye kushandiswa kwesimba kwemagetsi emotokari, kunyatsogadzirisa kupisa kunokosha. Iyo 6-layer HDI PCB inotsigira kuisirwa kwekupisa kwevias kubatsira kubvisa kupisa uye kugadzirisa tembiricha.
Izvi zvinobvumira masisitimu emotokari kuti ashande zvakanaka, kunyangwe pakupisa kwakanyanya.
