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Process Kugona

CAPEL FPC & Flex-Rigid PCB Kugadzira Kugona

Product High Density
Interconnect (HDI)
Standard Flex circuits Flex Flat Flexible Circuits Rigid Flex Circuit Membrane Swichi
Standard Panel Size 250mm X 400mm Roll fomati 250mmX400mm 250mmX400mm
mutsetse upamhi uye Spacing 0.035mm 0.035mm 0 .010"(0.24mm) 0.003"(0.076mm) 0.10"(.254mm)
Mhangura Kukora 9um/12um/18um/35um/70um/100um/140um 0.028mm-.01mm 1/2 oz.uye pamusoro 0.005"-.0010"
Layer Count 32 Single 32 Kusvika ku40
VIA / DILL SIZE
Minimum Drill ( Mechanical) Hole Diameter 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) N/A 0.006" ( 0.15 mm) 10 mirimita (0.25 mm)
Minimum Via ( Laser) Size 4 mirimita (0.1mm) 1 mirimita (0.025 mm) N/A 6 mirimita ( 0.15 mm) N/A
Minimum Micro Via ( Laser) Size 3 mil (0.076 mm) 1 mirimita ( 0.025 mm) N/A 3 mirimita ( 0.076 mm) N/A
Stiffener Material Polyimide / FR4 / Metal / SUS / Alu PET FR-4 / Poyimide PET / Metal/FR-4
Shielding Material Mhangura / sirivha Lnk / Tatsuta / Carbon Silver Foil/Tatsuta Mhangura / Silver Ink/Tadduta / Carbon Silver Foil
Tooling Material 2 mirimita ( 0.051 mm) 2 mirimita ( 0.051 mm) 10 mirimita (0.25mm) 2 mirimita (0.51 mm) 5 mirimita ( 0.13 mm)
Zif Kushivirira 2 mirimita ( .051 mm) 1 mirimita ( 0.025 mm) 10 mirimita (0.25mm) 2 mirimita (0.51 mm) 5 mirimita ( 0.13 mm)
SOLDER MASK
Solder Mask Bridge Pakati peDamu 5 mil ( .013 mm) 4 mi. N/A 5 mirimita ( 0.13 mm) 10 mirimita (0.25mm)
Solder Mask Registration Tolerance 4 mil ( .010 mm) 4 mirimita( 0.01mm) N/A 5 mirimita ( 0.13 mm) 5 mirimita ( 0.13 mm)
KAVIRI
Coverlay Registration 8 miriyoni 5 miriyoni 10 miriyoni 8 miriyoni 10 miriyoni
PIC Kunyoresa 7 miriyoni 4 miriyoni N/A 7 miriyoni N/A
Solder Mask Registration 5 miriyoni 4 miriyoni N/A 5 miriyoni 5 miriyoni
Surface Finish ENIG/Kunyudza Sirivha/Kunyudza Tin/Goridhe Plating/Tin Plating/OSP/ ENEPIG
Legend
Minimum Height 35 miriyoni 25 miriyoni 35 miriyoni 35 miriyoni Graphic Overlay
Minimun width 8 miriyoni 6 8 miriyoni 8 miriyoni
Minimum Space 8 miriyoni 6 8 miriyoni 8 miriyoni
Kunyoresa ±5mil ±5mil ±5mil ±5mil
Impedance ±10% ±10% ±20% ±10% NA
SRD ( Steel Rule Die )
Rondedzera Kushivirira 5 mil ( 0.13 mm) 2 miriyoni ( 0.051 mm) N/A 5 mirimita ( 0.13 mm) 5 mirimita ( 0.13 mm)
Minimum radius 5 mirimita (0.13 mm) 4 mirimita (0.10 mm) N/A 5 mirimita ( 0.13 mm) 5 mirimita ( 0.13 mm)
Mukati meRadhiyasi 20 mirimita (0.51 mm) 10 mirimita (0.25 mm) N/A 31 miriyoni 20 mirimita (0.51 mm)
Punch Minimum Hole Size 40 mirimita ( 10.2 mm) 31.5 miriyoni ( 0.80 mm) N/A N/A 40 mirimita (1.02 mm)
Kushivirira kwePunch Hole Saizi ± 2mil ( 0.051 mm) ± 1 mil N/A N/A ± 2 mil ( 0.051 mm)
Slot Width 20 mirimita (0.51 mm) 15 mirimita (0.38 mm) N/A 31 miriyoni 20 mirimita (0.51 mm)
Toleranc yegomba kurondedzera ± 3 miriyoni ± 2 miriyoni N/A ±4 miriyoni 10 miriyoni
Kushivirira kwegomba kumucheto kurondedzera ± 4 mil ± 3 miriyoni N/A ±5 miriyoni 10 miriyoni
Zvishoma zveTrace kutsanangura 8 miriyoni 5mil N/A 10 miriyoni 10 miriyoni

CAPEL PCB Kugadzira Kugona

Technical Parameters
Aihwa. Project Technical zviratidzo
1 Layer 1-60 (mutsetse)
2 Maximum processing area 545 x 622 mm
3 Minimumboard thickness 4(layer)0.40mm
6(layer) 0.60mm
8(mutsetse) 0.8mm
10(layer)1.0mm
4 Minimum line width 0.0762mm
5 Minimum spacing 0.0762mm
6 Minimum mechanical aperture 0.15mm
7 Gomba rusvingo rwemhangura ukobvu 0.015mm
8 Metallized aperture tolerance ± 0.05mm
9 Non-metallized aperture kushivirira ± 0.025mm
10 Gomba kushivirira ± 0.05mm
11 Dimensional kushivirira ± 0.076mm
12 Minimum solder zambuko 0.08mm
13 Insulation resistance 1E+12Ω (yakajairika)
14 Plate ukobvu ratio 1:10
15 Thermal shock 288 ℃ (4 nguva mumasekonzi gumi)
16 Yakakanganiswa uye yakakotama ≤0.7%
17 Anti-magetsi simba >1.3KV/mm
18 Anti-kubvisa simba 1.4N/mm
19 Solder ramba kuoma ≥6H
20 Flame retadancy 94V-0
21 Impedance control ±5%

CAPEL PCBA Kugadzira Kugona

Category Details
Nguva Yekutungamira Maawa makumi maviri nemana Prototyping, nguva yekuendesa yediki-batch inenge mazuva mashanu.
PCBA Kukwanisa SMT chigamba 2 miriyoni mapoinzi/zuva, THT 300,000 mapoinzi/zuva, 30-80 maodha / zuva.
Components Service Turnkey Iine yakakura uye inoshanda chikamu chekutenga manejimendi system, isu tinoshandira PCBA mapurojekiti ane yakanyanya-mutengo wekuita.Chikwata chevanyanzvi vekutenga mainjiniya uye vane ruzivo rwekutenga vashandi vane basa rekutenga uye manejimendi ezvikamu zvevatengi vedu.
Kitted kana kutumirwa Iine timu yakasimba yekutenga manejimendi uye chikamu chekutengesa cheni, Vatengi vanotipa zvinhu, tinoita basa regungano.
Combo Bvuma zvikamu kana zvikamu zvakakosha zvinopihwa nevatengi.uye zvakare zvikamu zvekushandisa kune vatengi.
PCBA Solder Type SMT, THT, kana PCBA soldering masevhisi ese ari maviri.
Solder Paste/Tin Wire/Tin Bar tungamira uye inotungamira-isina (RoHS inoenderana) PCBA yekugadzirisa masevhisi.Uye ipawo customized solder paste.
Stencil Laser yekucheka stencil kuve nechokwadi chekuti zvikamu zvakaita sediki-pitch ICs uye BGA kusangana neIPC-2 Kirasi kana yepamusoro.
MOQ 1 chidimbu, asi isu tinopa zano vatengi vedu kuti vagadzire angangoita mashanu masampuli ekuongorora kwavo uye kuyedzwa.
Chikamu Saizi • Passive components: isu takanaka pakukodzera iyo inch 01005 (0.4mm * 0.2mm), 0201 madiki madiki akadaro.
• High-precision ICs dzakadai seBGA: Tinogona kuona BGA zvikamu ne Min 0.25mm spacing ne X-ray.
Component Package reel, tepi yekucheka, tubing, uye mapallets ezvikamu zveSMT.
Maximum Mount Kurongeka kweZvikamu (100FP) Kururama kuri 0.0375mm.
Solderable PCB Type PCB (FR-4, simbi substrate), FPC, Rigid-flex PCB, Aluminium PCB, HDI PCB.
Layer 1-30(layer)
Maximum processing area 545 x 622 mm
Minimumboard thickness 4(layer)0.40mm
6(layer) 0.60mm
8(mutsetse) 0.8mm
10(layer)1.0mm
Minimum line width 0.0762mm
Minimum spacing 0.0762mm
Minimum mechanical aperture 0.15mm
Gomba rusvingo rwemhangura ukobvu 0.015mm
Metallized aperture tolerance ± 0.05mm
Non-metallized aperture ± 0.025mm
Gomba kushivirira ± 0.05mm
Dimensional kushivirira ± 0.076mm
Minimum solder zambuko 0.08mm
Insulation resistance 1E+12Ω (yakajairika)
Plate ukobvu ratio 1:10
Thermal shock 288 ℃ (4 nguva mumasekonzi gumi)
Yakakanganiswa uye yakakotama ≤0.7%
Anti-magetsi simba >1.3KV/mm
Anti-kubvisa simba 1.4N/mm
Solder ramba kuoma ≥6H
Flame retadancy 94V-0
Impedance control ±5%
File Format BOM, PCB Gerber, Sarudza uye Nzvimbo.
Testing Tisati tasununguka, isu tichashandisa nzira dzakasiyana dzekuedza kuPCBA mugomo kana kutokwira kare:
• IQC: kuongorora kunouya;
• IPQC: in-production inspection, LCR test for the first piece;
• Visual QC: routine quality check;
• AOI: solder effect ye patch components, zviduku kana polarity yezvikamu;
• X-Ray: tarisa BGA, QFN uye imwe yakakwirira yakarurama yakavanzwa PAD zvikamu;
• Functional Testing: Basa rekuedza uye kushanda maererano nemaitiro ekuedzwa kwevatengi uye maitiro ekuona kutevedza.
Kugadzirisa & Rework Yedu BGA Kugadzirisa Sevhisi inogona kubvisa zvakachengeteka yakarasika, kure-chinzvimbo, uye yekunyepedzera BGA uye kuibatanidza kuPCB zvakakwana.