Yakagadzirirwa PCB 12 Layer Rigid-Flex PCBs Factory yeFoni Nhare
Tsanangudzo
| Category | Process Kugona | Category | Process Kugona |
| Mhando yekugadzira | Single layer FPC / Double layer FPC Multi- layer FPC / Aluminium PCBs Rigid-Flex PCB | Layer Number | 1-16 zvikamu FPC 2-16 akaturikidzana Rigid-FlexPCB HDI Mabhodhi |
| Max Kugadzira Size | Single layer FPC 4000mm Doulbe layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm | Insulating Layer Ukobvu | 27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um / 150um |
| Board Ukobvu | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Kushivirira kwePTH Size | ± 0.075mm |
| Surface Finish | Kunyudza Goridhe/Kunyudzwa Silver/Gold Plating/Tin Plat ing/OSP | Stiffener | FR4 / PI / PET / SUS / PSA / Alu |
| Semicircle Orifice Size | Zvishoma 0.4mm | Min Line Space / hupamhi | 0.045mm/0.045mm |
| Makobvu Tolerance | ± 0.03mm | Impedance | 50Ω-120Ω |
| Copper Foil Ukobvu | 9um/12um/18um/35um/70um/100um | Impedance Controlled Kushivirira | ±10% |
| Kushivirira kweNPTH Size | ± 0.05mm | Iyo Min Flush Width | 0.80mm |
| Min Via Hole | 0.1mm | Shandisa Standard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Isu tinoita yakagadziridzwa PCB ine makore gumi nemashanu ruzivo nehunyanzvi hwedu
5 layer Flex-Rigid Boards
8 layer Rigid-Flex PCBs
8 layer HDI PCBs
Kuedza uye Kuongorora Equipment
Microscope Testing
Kuongorora kweAOI
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Yedu yakagadzirirwa PCB Service
. Ipa rubatsiro rwehunyanzvi Pre-kutengesa uye mushure-kutengesa;
. Tsika anosvika makumi mana akaturikidzana, 1-2days Kurumidza kutendeuka yakavimbika prototyping, Component procurement, SMT Assembly;
. Inobata kune ese ari maviri Medical Device, Industrial Control, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications etc..
. Zvikwata zvedu zvemainjiniya nevatsvaguri vakazvipira kuzadzisa zvaunoda nehungwaru uye nehunyanzvi.
Iyo chaiyo application yegumi nemaviri layer Rigid-Flex PCBs munharembozha
1. Interconnection: Rigid-flex boards inoshandiswa pakubatanidza zvinhu zvakasiyana-siyana zvemagetsi mukati memafoni efoni, kusanganisira microprocessors, memory chips, zviratidzo, makamera uye mamwe ma modules. Iwo akawanda akaturikidzana ePCB anobvumira kuomarara dhizaini dhizaini, kuve nechokwadi chekufambisa kwemasaini uye kuderedza kukanganiswa kwemagetsi.
2. Form factor optimization: Iko kushanduka uye compactness ye rigid-flex board inobvumira vagadziri vefoni kuti vagadzire michina yakapfava uye yakatetepa. Iko kusanganiswa kweakaomarara uye anochinjika akaturikidzana anobvumira iyo PCB kukotama uye kupeta kuti ikwane munzvimbo dzakasimba kana kuenderana nechimiro chechishandiso, kuwedzera yakakosha nzvimbo yemukati.
3. Kugara uye kuvimbika: Nharembozha dzinoiswa pasi pekunetseka kwakasiyana-siyana kwemagetsi sekukotama, kumonyorora uye kuzunguza.
Rigid-flex PCBs dzakagadzirirwa kumirisana nezvinhu izvi zvakatipoteredza, kuve nechokwadi chekuvimbika kwenguva refu uye kudzivirira kukanganisa kuPCB uye zvikamu zvayo. Kushandiswa kwezvinhu zvemhando yepamusoro uye nzira dzekugadzira dzepamusoro dzinosimudzira kusimba kwese kwechishandiso.
4. Yakakwirira-density wiring: Iyo yakawanda-layer chimiro che 12-layer rigid-flex board inogona kuwedzera wiring density, zvichiita kuti nharembozha ibatanidze zvimwe zvikamu uye mabasa. Izvi zvinobatsira kuita miniaturize chishandiso pasina kukanganisa kuita kwayo uye kushanda kwayo.
5. Kuvandudzwa kwechiratidzo chekutendeseka: Kuenzaniswa nePCBs dzechinyakare dzakasimba, dzakaoma-flex PCB dzinopa zviratidzo zviri nani.
Iko kuchinjika kwePCB kunoderedza kurasikirwa kwechiratidzo uye kukanganisa kusawirirana, nekudaro ichiwedzera mashandiro uye dhata yekuchinjisa chiyero cheyakakwira-kumhanyisa data yekubatanidza, nharembozha seWi-Fi, Bluetooth uye NFC.
12-layer rigid-flex mabhodhi munharembozha ane zvimwe zvakanakira uye kuwedzera kushandiswa
1. Thermal management: Mafoni anogadzira kupisa panguva yekushanda, kunyanya neinoda maapplication uye kugadzirisa mabasa.
Rigid-flex PCB's yakawanda-layer inochinjika chimiro inoita kuti ishande kupisa kupisa uye kutonga kwekupisa.
Izvi zvinobatsira kudzivirira kupisa uye kuve nechokwadi chekugara kwenguva refu kwechigadzirwa.
2. Kubatanidzwa kwechikamu, kuchengetedza nzvimbo: Kushandisa 12-layer soft-rigid board, vagadziri vefoni vanogona kubatanidza zvinhu zvakasiyana-siyana zvemagetsi uye mabasa mune rimwe bhodhi. Kubatanidzwa uku kunochengetedza nzvimbo uye kunorerutsa kugadzira nekubvisa kudiwa kwemamwe mabhodhi edunhu, tambo uye zvinobatanidza.
3. Yakasimba uye yakasimba: 12-layer rigid-flex PCB inopesana zvikuru ne mechanical stress, shock uye vibration.
Izvi zvinoita kuti ive yakakodzera kune dzakaomarara nharembozha mafomu senge ekunze ma smartphones, echiuto-giredhi midziyo, uye maindasitiri emaoko emaoko anoda kusimba uye kuvimbika munzvimbo dzakaoma.
4. Inodhura-inoshanda: Kunyange zvazvo maPCB akaoma-flex angave ane mari yekutanga yepamusoro kupfuura maPCB akaomeswa, anogona kuderedza kugadzirwa kwese uye mari yegungano nekubvisa zvimwe zvinobatanidza zvikamu zvakadai sezvibatanidza, waya, uye tambo.
Iyo yakagadziridzwa gungano maitiro zvakare inoderedza mukana wekukanganisa uye inoderedza rework, zvichikonzera kuchengetedza mutengo.
5. Dhizaini kuchinjika: Iko kuchinjika kweiyo rigid-flex PCBs inobvumira hunyanzvi uye kugadzira madhizaini e-smartphone.
Vagadziri vanogona kutora mukana wezvakasiyana mafomu maficha nekugadzira maratidziro akakomberedzwa, anopeta mafoni, kana zvishandiso zvine zvimiro zvisina kujairika. Izvi zvinosiyanisa musika uye zvinowedzera ruzivo rwemushandisi.
6. Electromagnetic Compatibility (EMC): Kana ichienzaniswa neyakaomarara maPCB, maPCB akaomesesa ane mashandiro arinani eEMC.
Iwo akaturikidzana uye zvinhu zvinoshandiswa zvakagadzirirwa kubatsira kudzikisira kukanganiswa kwemagetsi (EMI) uye kuve nechokwadi chekutevedzera mitemo. Izvi zvinovandudza mhando yechiratidzo, inoderedza ruzha uye inonatsiridza kuita kwese kwechishandiso.
