Kaviri-Layer FR4 Yakadhindwa Circuit Boards
PCB Process Kugona
| Aihwa. | Project | Technical zviratidzo |
| 1 | Layer | 1-60 (mutsetse) |
| 2 | Maximum processing area | 545 x 622 mm |
| 3 | Minimumboard thickness | 4(layer)0.40mm |
| 6(layer) 0.60mm | ||
| 8(mutsetse) 0.8mm | ||
| 10(layer)1.0mm | ||
| 4 | Minimum line width | 0.0762mm |
| 5 | Minimum spacing | 0.0762mm |
| 6 | Minimum mechanical aperture | 0.15mm |
| 7 | Gomba rusvingo rwemhangura ukobvu | 0.015mm |
| 8 | Metallized aperture tolerance | ± 0.05mm |
| 9 | Non-metallized aperture kushivirira | ± 0.025mm |
| 10 | Gomba kushivirira | ± 0.05mm |
| 11 | Dimensional kushivirira | ± 0.076mm |
| 12 | Minimum solder zambuko | 0.08mm |
| 13 | Insulation resistance | 1E+12Ω (yakajairika) |
| 14 | Plate ukobvu ratio | 1:10 |
| 15 | Thermal shock | 288 ℃ (4 nguva mumasekonzi gumi) |
| 16 | Yakakanganiswa uye yakakotama | ≤0.7% |
| 17 | Anti-magetsi simba | ＞1.3KV/mm |
| 18 | Anti-kubvisa simba | 1.4N/mm |
| 19 | Solder ramba kuoma | ≥6H |
| 20 | Flame retadancy | 94V-0 |
| 21 | Impedance control | ±5% |
Isu tinoita Printed Circuit Boards ane makore gumi nemashanu ruzivo nehunyanzvi hwedu
4 layer Flex-Rigid Boards
8 layer Rigid-Flex PCBs
8 layer HDI Yakadhindwa Circuit Boards
Kuedza uye Kuongorora Equipment
Microscope Testing
Kuongorora kweAOI
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Yedu Yakadhindwa Circuit Boards Service
. Ipa rubatsiro rwehunyanzvi Pre-kutengesa uye mushure-kutengesa;
. Tsika anosvika makumi mana akaturikidzana, 1-2days Kurumidza kutendeuka yakavimbika prototyping, Component procurement, SMT Assembly;
. Inobata kune ese ari maviri Medical Device, Industrial Control, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications etc..
. Zvikwata zvedu zvemainjiniya nevatsvaguri vakazvipira kuzadzisa zvaunoda nehungwaru uye nehunyanzvi.
Kaviri-layer FR4 Yakadhindwa Circuit Boards inoiswa mumahwendefa
1. Simba rekugovera: Simba rekugovera kwepiritsi PC rinotora kaviri-layer FR4 PCB. Aya maPCB anogonesa kufambiswa kwakanaka kwetambo dzemagetsi kuti ive nechokwadi chakakodzera mazinga emagetsi uye kugovera kune akasiyana zvikamu zvehwendefa, kusanganisira kuratidza, processor, ndangariro uye yekubatanidza modules.
2. Signal routing: I-double-layer FR4 PCB inopa wiring inodiwa uye nzira yekutumira zviratidzo pakati pezvikamu zvakasiyana-siyana uye modules mukombiyuta yepiritsi. Ivo vanobatanidza akasiyana-siyana akabatanidzwa maseketi (ICs), zvinongedzo, masensa, uye zvimwe zvikamu, kuve nechokwadi kutaurirana kwakakodzera uye kuendesa data mukati memidziyo.
3. Component Mounting: I-double-layer FR4 PCB yakagadzirirwa kugadzirisa kuiswa kwezvinhu zvakasiyana-siyana zveSurface Mount Technology (SMT) muhwendefa. Izvi zvinosanganisira microprocessors, memory modules, capacitors, resistors, integrated circuits uye connectors. PCB dhizaini uye dhizaini inovimbisa nzvimbo yakakodzera uye kurongeka kwezvikamu kuti uwedzere kushanda uye kuderedza kukanganiswa kwechiratidzo.
4. Kukura uye compactness: FR4 PCBs dzinozivikanwa nokuda kwekugara uye zvishoma zvishoma, zvichiita kuti dzive dzakakodzera kushandiswa mumagetsi emagetsi akadai semapiritsi. Kaviri-layer FR4 PCBs inobvumira hukuru hwezvikamu munzvimbo shoma, zvichiita kuti vagadziri vagadzire mahwendefa matete uye akareruka pasina kukanganisa kushanda.
5. Mutengo-kubudirira: Kana ichienzaniswa nepamusoro PCB substrates, FR4 chinhu chinokwanisika kutenga. Kaviri-layer FR4 PCBs inopa mhinduro inodhura kune vagadziri vemapiritsi vanoda kuchengetedza mutengo wekugadzira wakaderera uchichengetedza kunaka uye kuvimbika.
Ko Kaviri-layer FR4 Yakadhindwa Circuit Boards inosimudzira sei kuita uye kushanda kwemapiritsi?
1. Ndege dzepasi uye dzemagetsi: Maviri-layer FR4 PCBs anowanzo ane ndege dzakatsaurirwa pasi uye magetsi kubatsira kuderedza ruzha uye kugonesa kugovera kwemagetsi. Ndege idzi dzinoita sereferensi yakagadzikana yechiratidzo chekutendeka uye kuderedza kupindirana pakati pemaseketi akasiyana uye zvikamu.
2. Inodzorwa impedance routing: Kuti uve nechokwadi chekufambisa kwechiratidzo chakavimbika uye kuderedza kuderedzwa kwechiratidzo, inodzorwa impedance routing inoshandiswa mukugadzirwa kwekaviri-layer FR4 PCB. Aya maratidziro akanyatso gadzirwa nehupamhi hwakasiyana uye nzvimbo yekusangana nezvinodiwa zve impedance yeakakwira-kumhanya masaini uye maratidziro akadai se USB, HDMI kana WiFi.
3. EMI / EMC shielding: Double-layer FR4 PCB inogona kushandisa shielding teknolojia kuderedza electromagnetic interference (EMI) uye kuvimbisa kuenderana kwemagetsi (EMC). Copper layers kana nhovo inogona kuwedzerwa kuPCB dhizaini kuti iparadzanise masekete akadzikama kubva kunze kweEMI masosi uye kudzivirira kubuda kunogona kukanganisa mamwe maturusi kana masisitimu.
4. High-frequency design considerations: Kune mahwendefa ane ma-high-frequency components kana ma modules akadai se cellular connectivity (LTE / 5G), GPS kana Bluetooth, kugadzirwa kwekaviri-layer FR4 PCB inoda kufunga nezvekushanda kwepamusoro-frequency. Izvi zvinosanganisira impedance yekufananidza, inodzorwa crosstalk uye yakakodzera RF nzira dzekufambisa kuti ive nechokwadi chekuvimbika kwechiratidzo uye kurasikirwa kushoma kutapurirana.
