4-Layer PCB Stackup: Mazano ekugadzira Mazano

Munyaya ino yakazara, isu tinoongorora nyika ye4-layer PCB stackups, ichikutungamira iwe kuburikidza neakanakisa dhizaini matekiniki uye kufunga.

Nhanganyaya :

Munyika yePCB (yakadhindwa redunhu bhodhi) dhizaini, kuwana yakaringana stackup kwakakosha kuti uve nechokwadi chekuenderana uye kushanda kwakavimbika. Kuzadzisa izvo zvinoramba zvichiwedzera zvinodiwa zvemidziyo yemazuva ano yemagetsi, senge kukurumidza kumhanya, kukwira kwepamusoro, uye kuderedzwa kwechiratidzo kukanganiswa, yakarongwa zvakanaka 4-layer PCB stackup yakakosha. Ichi chinyorwa chinoshanda segwara rakazara rekukubatsira iwe kuti unzwisise akakosha maficha uye kufunga kunobatanidzwa mukuwana yakakwana 4-layer PCB stack-up. Saka, ngationgororei munyika yePCB stackup uye tifukure zvakavanzika kune yakabudirira dhizaini!

zvirimo:

1. Nzwisisa izvo zvekutanga zve4-layer PCB stacking :
-PCB Stackup: Chii uye nei yakakosha?
-Kufunga kwakakosha kwe4-layer stack dhizaini.
- Kukosha kwekugadzirisa kwakaringana layer.
-Kusaina uye kugovera maseru: mabasa nenzvimbo.
-Zvinhu zvinokanganisa kusarudzwa kwemukati musimboti uye prepreg zvinhu.

PCB stackup:PCB stackup inoreva kurongeka uye kumisikidzwa kwematanho akasiyana mubhodhi rakadhindwa redunhu. Inosanganisira kuisa conductive, insulating, uye masiginecha yekugovera maseru mune yakananga kurongeka kuti uwane inodiwa magetsi kuita uye kushanda kwePCB. PCB stackup yakakosha nekuti inosarudza chiratidzo chekuvimbika, kugovera simba, kutonga kwekupisa uye kuita kwePCB.

Mafungiro akakosha e4-Layer Stack Dhizaini:

Paunenge uchigadzira 4-layer PCB stack-up, mamwe akakosha ekufunga anosanganisira:
Chiratidzo chekuvimbika
Kuisa masignal layers padhuze neapo uchichengeta simba nendege dzepasi padhuze kunonatsiridza kutendeseka kwechiratidzo nekudzikisira iyo impedance pakati pechiratidzo chechiratidzo uye ndege dzekutarisa.
Simba uye Ground Distribution:
Kugovera kwakakodzera uye kuiswa kwesimba uye ndege dzepasi kwakakosha pakugovera simba kunoshanda uye kuderedza ruzha. Izvo zvakakosha kuti utarise kune ukobvu uye nzvimbo pakati pesimba uye pasi ndege kuti uderedze impedance.
Thermal management:
Kuiswa kweiyo thermal vias uye kupisa kunyura uye kugoverwa kwendege dzinopisa kunofanirwa kutariswa kuti ive nechokwadi chekubvisa kupisa kwakanaka uye kudzivirira kupisa.
Kuiswa kwechikamu uye routability:
Kunyatsotariswa kunofanira kupihwa pakuiswa kwechikamu uye nzira kuti ive nechokwadi chekufambisa kwemasaini uye kudzivirira kukanganiswa kwechiratidzo.

Kukosha Kwekugadzirisa Kwakanaka Layer:Layer kurongeka muPCB stack yakakosha kuchengetedza chiratidzo chekuvimbika, kuderedza kukanganiswa kwemagetsi (EMI), uye kutonga kugovera kwemagetsi. Yakakodzera layer yekuisa inovimbisa inodzorwa impedance, inoderedza crosstalk, uye inovandudza kuita kwese kwePCB dhizaini.

Chiratidzo uye maseru ekuparadzira:Masignals anowanzo kufambiswa pamusoro uye nechepasi masignal layers, ukuwo simba nendege dzepasi dziri mukati. Iyo yekugovera layer inoshanda sesimba uye yepasi ndege uye inopa yakaderera impedance nzira yesimba uye pasi kubatana, kuderedza kudonha kwevoltage uye EMI.

Zvinhu Zvinokanganisa Core uye Prepreg Kusarudzwa Kwezvinhu:Sarudzo yezvakakosha uye prepreg zvinhu zvePCB stackup zvinoenderana nezvinhu zvakaita sezvinodiwa nemagetsi ekuita, kutariswa kwemafuta ekutarisira, manufacturability, uye mutengo. Zvimwe zvinhu zvakakosha zvekufunga nezvazvo zvinosanganisira dielectric constant (Dk), dissipation factor (Df), girazi rekuchinja tembiricha (Tg), ukobvu, uye kuenderana nemagadzirirwo ekugadzira senge lamination nekuchera. Kunyatsosarudzwa kwezvishandiso izvi kunovimbisa zvinodiwa zvemagetsi uye zvemuchina zvePCB.

2. Matekiniki eakakwana 4-layer PCB stackup:

-Kungwarira kwechikamu kuiswa uye kutsvaga nzira yesimba rinoshanda uye chiratidzo chekuvimbika.
-Basa rendege dzepasi uye dzemagetsi mukuderedza ruzha uye kuwedzera kutendeseka kwechiratidzo.
-Sarudza hukobvu hwakakodzera uye dielectric inogadzika yega yega.
- Tora mukana weinodzorwa impedance nzira yeakakwira-kumhanya dhizaini.
-Kufunga kwemafuta uye manejimendi ekupisa mumatanho akawanda.

Aya matekiniki anobatsira kuwana yakakwana 4-layer PCB stackup:

Kunyatsoisa chikamu uye kutsvaga nzira:Simba rinoshanda uye chiratidzo chekuvimbika chinogona kuwanikwa kuburikidza nekuchenjerera chikamu chekuisa uye kutsvaga nzira. Boka zvinhu zvine chekuita neboka pamwe chete uye simbisa hukama hupfupi, hwakananga pakati pazvo. Deredza kureba kwekutsvaga uye kudzivirira kuyambuka twunhu twakanzwikwa. Shandisa kupatsanura kwakafanira uye chengetedza masaini ari kure kure nekunobva ruzha.

Ground uye Power Planes:Ndege dzepasi uye dzemagetsi dzinoita basa rakakosha mukuderedza ruzha uye kuwedzera kutendeseka kwechiratidzo. Shandisa yakatsaurirwa pasi uye ndege dzemagetsi kupa yakagadzikana referensi ndege uye kuderedza electromagnetic interference (EMI). Iva nechokwadi chekubatana kwakakodzera kune idzi ndege kuchengetedza yakaderera impedance nzira yekudzoka ikozvino.

Sarudza kwakakodzera layer ukobvu uye dielectric inogara:Ukobvu uye dielectric kugara kwega kwega mustack kunokanganisa kupararira kwechiratidzo uye impedance control. Sarudza iyo yaidiwa impedance kukosha uye sarudza iyo yakakodzera ukobvu uye dielectric inongogara kune imwe neimwe layer zvinoenderana. Ongorora iyo PCB dhizaini dhizaini uye funga yechiratidzo frequency uye yekufambisa mitsara zvinodiwa.

Inodzorwa Impedance Routing:Kudzorwa impedance routing kwakakosha kune yakakwirira-kumhanya dhizaini kuderedza zviratidzo zvechiratidzo, kuchengetedza chiratidzo chekuvimbika, uye kudzivirira kukanganisa kwedata. Sarudza iyo inodiwa impedance kukosha kwezviratidzo zvakakosha uye shandisa inodzorwa impedance nzira dzekuita senge mutsauko pairi, stripline kana microstrip routing, uye inodzorwa impedance vias.

Thermal Kufunga uye Management:Thermal management yakakosha kune multilayer PCB stacks. Kupisa kwakakodzera kwekupisa kunoita kuti zvikamu zvishande mukati memiganho yetembiricha uye inodzivirira kukuvara kunogona kuitika. Funga kuwedzera zvinopisa vias kuendesa kupisa kune yemukati pasi ndege kana thermal Mapedhi, shandisa thermal vias pedyo yakakwirira simba zvinoriumba, uye batanidza kupisa singi kana mhangura anodira nani kupisa kuparadzirwa.

Nekushandisa matekiniki aya, unogona kuve nechokwadi chekugovera simba, kuderedza ruzha, kuchengetedza chiratidzo chekuvimbika, uye kukwidziridza manejimendi ekupisa mune 4-layer PCB stackup.

3. Dhizaini kufunga kwekugadzira 4-layer PCB :

- Balance manufacturability uye dhizaini yakaoma.
- Dhizaini Yekugadzira (DFM) Yakanakisa Maitiro.
- Kuburikidza nemhando uye magadzirirwo ekufunga.
-Mitemo yedhizaini yekupatsanura, kuteedzera hupamhi, uye kucheneswa.
-Shanda nePCB mugadziri kuti uwane yakakwana stackup.

Kuenzanisa Kugadzirwa uye Dhizaini Yakaoma:Paunenge uchigadzira 4-layer PCB, zvakakosha kurova chiyero pakati pekuoma kwekugadzira uye nyore kugadzira. Madhizaini akaomarara anogona kuwedzera mutengo wekugadzira uye zvikanganiso zvingangoitika. Kurerutsa dhizaini nekugadzirisa kuisirwa kwechikamu, kuronga chiratidzo chekufambisa, uye kushandisa yakamisikidzwa dhizaini mitemo kunogona kuvandudza manufacturability.

Dhizaini Yekugadzira (DFM) Maitiro Akanakisisa:Batanidza kufunga kweDFM mumagadzirirwo kuti ave nechokwadi chekugadzira uye chisina kukanganisa. Izvi zvinosanganisira kutevedzera indasitiri-yakajairwa dhizaini mitemo, kusarudza zvinhu zvakakodzera uye ukobvu, uchifunga zvipingamupinyi zvekugadzira zvakaita sedikidiki fararira uye nzvimbo, uye kudzivirira maumbirwo akaomarara kana maficha anogona kuwedzera kuoma kwekugadzira.

Kuburikidza neRudzi uye Magadzirirwo Mafungiro:Kusarudza yakakodzera kuburikidza nemhando uye marongero ayo akakosha kune 4-layer PCB. Vias, mapofu vias, uye akavigwa vias mumwe nomumwe ane zvazvakanakira nezvaasingakwanisi. Nyatsofunga mashandisirwo azvo zvichibva pakugadzira kuoma uye kuwanda, uye chengetedza kucheneswa kwakakodzera uye nzvimbo yakatenderedza vias kudzivirira kukanganiswa kwechiratidzo uye kubatanidza magetsi.

Dhizaini Mitemo yeChinzvimbo, Chengetedza Upamhi, uye Kujeka:Tevedzera yakakurudzirwa dhizaini mitemo yekupatsanura, kutsvaga upamhi, uye kucheneswa kunopihwa nemugadziri wePCB. Iyi mitemo inovimbisa kuti dhizaini inogona kugadzirwa pasina matambudziko, akadai semagetsi mapfupi kana kuora kwechiratidzo. Kuchengetedza nzvimbo yakaringana pakati pematanho uye zvikamu, kuchengetedza kubvumidzwa kwakakodzera munzvimbo dzakakwirira-voltage, uye kushandisa kwakaringana hupamhi hwekutevera kune inodiwa ikozvino-inotakura simba zvese zvakakosha kufunga.

Shanda nemugadziri wePCB kune yakakwana stackup:Shanda nemugadziri wePCB kuona iyo yakakwana stackup ye4-layer PCB. Zvinhu zvekufunga nezvazvo zvinosanganisira mhangura zvidimbu, dielectric zvinhu kusarudzwa uye kuiswa, inodiwa impedance control, uye chiratidzo chekuvimbika zvinodiwa. Nekushanda padhuze nevagadziri, unogona kuve nechokwadi chekuti PCB magadzirirwo anoenderana nekugona kwavo uye maitiro ekugadzira, zvichikonzera kugadzirwa kwakanyanya uye kusingadhuri.

Pakazere, kugadzira 4-layer PCB kunoda kunyatsonzwisiswa kwekugadzirwa, kuomerera kuDFM yakanakisa maitiro, kunyatsotarisisa kuburikidza nemhando uye marongerwo, kuomerera kumitemo yekugadzira, uye kubatana nemugadziri wePCB kuti uwane yakakwana stackup. Nekufunga izvi zvinhu, unogona kuvandudza manufacturability, kuvimbika, uye kuita kwePCB dhizaini yako.

4. Zvakanakira uye zvisingakwanisi 4-layer PCB stackup:

- Inovandudza chiratidzo chekuvimbika, inoderedza ruzha uye inoderedza EMI mhedzisiro.
-Kunatsiridza kugona kuita yakakwirira-kumhanya dhizaini.
-Space-yekuchengetedza mukana wekombuta zvemagetsi.
-Zvinogona zvinogumira uye matambudziko ekushandisa 4-layer stack.

Zvakanakira zve4-layer PCB stackup:

Chiratidzo Chakawedzerwa Kutendeseka:
Kuwedzera pasi uye ndege dzemagetsi mu-4-layer stack dzinobatsira kuderedza ruzha rwechiratidzo uye kuve nechokwadi chekuvimbika kwechiratidzo chepamusoro-kumhanya dhizaini. Iyo ndege yepasi inoita seyakavimbika referensi ndege, inoderedza chiratidzo checrosstalk nekuvandudza impedance control.
Yakaderedzwa ruzha uye EMI kukanganisa:
Kuvepo kwendege dzepasi uye dzesimba mune 4-layer stack kunobatsira kudzikisira kukanganiswa kwemagetsi (EMI) nekupa dziviriro uye nekuvandudza chiratidzo chekudzika. Izvi zvinopa zvirinani kuderedza ruzha uye inova nechokwadi chekufambisa kwemasaini akajeka.
Kuwedzera kugona kuita yakakwira-kumhanya dhizaini:
Nemamwe maseru, vagadziri vane mamwe maitiro ekufambisa. Izvi zvinogonesa akaomesesa epamusoro-kumhanya dhizaini ane inodzorwa impedance zvinodiwa, kuderedza chiratidzo chekumisikidza uye kuwana yakavimbika mashandiro pane yakakwirira frequencies.
Mukana wekuchengetedza nzvimbo:
4-layer stacking inobvumira kuti iwedzere compact uye inoshanda dhizaini. Inopa mamwe maitiro ekufambisa uye inoderedza kudiwa kwekubatana kwakawanda pakati pezvikamu, zvichiita kuti pave nechinhu chiduku chechimiro chemagetsi emagetsi. Izvi zvinonyanya kubatsira kune inotakurika magetsi kana ine vanhu vakawanda PCB.

Zvipingamupinyi uye matambudziko ekushandisa 4-layer stack:

Mutengo:
Kuita 4-layer stackup kunowedzera mutengo wakazara wePCB uchienzaniswa ne2-layer stackup. Mutengo unopesvedzerwa nezvinhu zvakaita sehuwandu hwematanho, dhizaini yakaoma, uye inodiwa maitiro ekugadzira. Mamwe maturu anoda zvimwe zvekushandisa, mamwe chaiwo ekugadzira matekiniki, uye hunyanzvi hwekufambisa nzira.
Design Complexity:
Kugadzira 4-layer PCB inoda kungwarira kuronga kupfuura 2-layer PCB. Mamwe masaira anopa matambudziko mukuiswa kwechikamu, nzira uye kuburikidza nekuronga. Vagadziri vanofanirwa kunyatso funga nezve kutendeseka kwechiratidzo, impedance control, uye kugovera magetsi, izvo zvinogona kuoma uye kutora nguva.
Zvipimo zvekugadzira:
Kugadzira 4-layer PCBs kunoda mamwe epamberi ekugadzira maitiro uye matekiniki. Vagadziri vanofanirwa kukwanisa kunyatso rongedza uye laminate zvidimbu, kudzora ukobvu hwega ega dhizaini, uye kuve nechokwadi kurongeka kwakaringana kwekudhirowa uye vias. Havasi vese vanogadzira PCB vanokwanisa kugadzira 4-layer board.
Noise uye Kupindira:
Nepo 4-layer stack-up ichibatsira kuderedza ruzha uye EMI, kusakwana dhizaini kana magadzirirwo maitiro anogona kuramba achikonzera ruzha uye kukanganisa nyaya. Kusaitwa zvisina kufanira layer stacking kana kusakwana ivhu kunogona kutungamirira kukusazvironga kubatanidza uye chiratidzo attenuation. Izvi zvinoda kunyatsoronga uye kutariswa kwemaitiro ekugadzira uye kuiswa kwendege yepasi.
Thermal management:
Kuvapo kwezvikamu zvekuwedzera kunokanganisa kupisa kwekupisa uye kutonga kwekushisa. Dense dhizaini ine nzvimbo shoma pakati pematanho inogona kutungamira kukuwedzera kupisa kwekupisa uye kupisa kuvaka. Izvi zvinoda kunyatsotariswa kwechikamu marongerwo, thermal vias, uye dhizaini yakazara yekupisa kudzivirira nyaya dzekupisa.

Izvo zvakakosha kuti vagadziri vanyatso ongorora zvavanoda, vachifunga zvakanakira uye zvisingakwanisi 4-layer PCB stackup, kuitira kuti vaite sarudzo ine ruzivo pane yakanakisa stackup yeimwe dhizaini yavo.

Muchidimbu,kuwana yakakwana 4-layer PCB stackup kwakakosha pakuona yakavimbika uye yepamusoro-inoshanda yemagetsi dhizaini. Nekunzwisisa zvakakosha, tichifunga maitiro ekugadzira, uye nekubatana nevagadziri vePCB, vagadziri vanogona kutora mukana wekugovera simba kwakasimba, kutendeseka kwechiratidzo, uye kuderedza EMI mhedzisiro. Izvo zvinofanirwa kuyeukwa kuti yakabudirira 4-layer stack dhizaini inoda kungwarira nzira uye kutarisisa kwechikamu chekuisa, nzira, yekupisa manejimendi uye manufacturability. Saka tora ruzivo rwakapihwa mugwaro iri uye tanga rwendo rwako kuti uwane yakanakisa 4-layer PCB stack yepurojekiti yako inotevera!