Ichi chinyorwa chinopa tarisiro yakazara yemaitiro epamusoro ekurapa kweFPC Flex PCB kugadzira. Kubva pakukosha kwekugadzirira kwepamusoro kune nzira dzakasiyana dzekupfekedza pamusoro, isu tinovhara ruzivo rwakakosha kuti tikubatsire kunzwisisa uye kuita maitiro ekugadzirira kwepamusoro.
Nhanganyaya:
Flexible PCBs (Flexible Printed Circuit Boards) ari kuwana mukurumbira mumaindasitiri akasiyana siyana nekuda kwekusiyana-siyana uye kugona kuchinjika kune akaomarara maumbirwo. Maitiro ekugadzirira kwepamusoro anoita basa rakakosha mukuona kushanda kwakakwana uye kuvimbika kweaya maseketi anochinjika. Ichi chinyorwa chinopa tarisiro yakazara yemaitiro epamusoro ekurapa kweFPC Flex PCB kugadzira. Kubva pakukosha kwekugadzirira kwepamusoro kune nzira dzakasiyana dzekupfekedza pamusoro, isu tinovhara ruzivo rwakakosha kuti tikubatsire kunzwisisa uye kuita maitiro ekugadzirira kwepamusoro.
Zviri mukati:
1. Kukosha kwekurapwa kwepamusoro muFPC flex PCB kugadzira:
Kurapa kwepamusoro kwakakosha muFPC Flexible mabhodhi kugadzira sezvo ichishandira zvinangwa zvakawanda. Inofambisa soldering, inovimbisa kunamatira kwakanaka, uye inodzivirira maitiro ekuitisa kubva kune oxidation uye kuparara kwezvakatipoteredza. Sarudzo uye mhando yekurapa kwepamusoro inobata zvakananga kuvimbika uye kuita kwese kwePCB.
Kupedzisa kwepamusoro muFPC Flex PCB kugadzira kunoshanda zvakati wandei zvakakosha.Kutanga, inofambisa kutengesa, kuve nechokwadi chekubatanidza kwakakodzera kwezvinhu zvemagetsi kuPCB. Iko kurapwa kwepamusoro kunowedzera solderability yekubatana kwakasimba uye kwakavimbika pakati pechikamu nePCB. Pasina kugadzirira kwakakodzera kwepamusoro, majoini e solder anogona kuva asina simba uye anowanzoita kukundikana, zvichiita kuti zvive zvisina kukwana uye zvinogona kukanganisa dunhu rose.
Chimwe chinhu chakakosha chekugadzirira kwepamusoro mukugadzira FPC Flex PCB kuve nechokwadi chekunamatira kwakanaka.FPC flex PCBs inowanzosangana nekukotama kwakanyanya uye kuchinjika mukati mehupenyu hwavo hwesevhisi, izvo zvinoisa kushushikana paPCB nezvikamu zvayo. Mushonga wepamusoro unopa chidziviriro chekudzivirira kuti ive nechokwadi chekuti chikamu chacho chakanyatso kunamatira kuPCB, kudzivirira kukanganisa kunogona kuitika kana kukanganisa panguva yekubata. Izvi zvinonyanya kukosha mumashandisirwo apo mechanical stress kana vibration zvakajairika.
Pamusoro pezvo, kurapwa kwepamusoro kunodzivirira maitiro ekufambisa paFPC Flex PCB kubva kune oxidation uye kukanganisa kwezvakatipoteredza.Aya maPCB anogara achioneswa kune akasiyana siyana ezvakatipoteredza zvinhu senge humidity, tembiricha shanduko uye makemikari. Pasina kugadzirira kwakakwana kwepamusoro, maitiro ekufambisa anogona kukanganisa nekufamba kwenguva, zvichikonzera kutadza kwemagetsi uye kutadza kwedunhu. Kurapa kwepamusoro kunoshanda sechipingamupinyi, kuchengetedza PCB kubva kune zvakatipoteredza uye kuwedzera hupenyu hwayo uye kuvimbika.
2.Common pamusoro pekurapa nzira dzeFPC flex PCB kugadzira:
Ichi chikamu chichakurukura zvakadzama nzira dzinonyanya kushandiswa pamusoro pekurapa kwepamusoro muFPC Flexible boards kugadzira, kusanganisira Hot Air Solder Leveling (HASL), Electroless Nickel Immersion Gold (ENIG), Organic Solderability Preservative (OSP), Immersion Tin (ISn) uye electroplating. (E-plating). Nzira imwe neimwe ichatsanangurwa pamwe chete nezvakanakira uye zvayakaipira.
Kupisa Kwemhepo Solder Kuyera (HASL):
HASL inzira inoshandiswa zvakanyanya pamusoro pekurapa kwepamusoro nekuda kwekuita kwayo uye kudhura kwayo. Maitiro acho anosanganisira kupfekedza nzvimbo yemhangura nerunyoro rwe solder, iyo inobva yapiswa nemhepo inopisa kuti igadzire nzvimbo yakatsetseka, yakati sandara. HASL inopa yakanakisa solderability uye inoenderana neyakasiyana siyana yezvikamu uye nzira dzekutengesa. Nekudaro, ine zvakare ine zvinogumira senge kusaenzana kwepamusoro kupera uye kukuvara kunobvira kune akatetepa mamaki panguva yekugadziriswa.
Electroless Nickel Immersion Gold (ENIG):
ENIG isarudzo yakakurumbira mukugadzira flex wedunhu nekuda kwekuita kwayo kwepamusoro uye kuvimbika. Maitirwo acho anosanganisira kuisa chidimbu chitete chenickel pamusoro pemhangura kuburikidza nekemikari inoitika, inozonyudzwa mumushonga we electrolyte une zvimedu zvegoridhe. ENIG ine yakanakisa corrosion kuramba, yunifomu ukobvu kugovera uye yakanaka solderability. Nekudaro, mitengo yakakwira-inoenderana nemaitiro uye zvingangoita dema pad nyaya ndezvimwe zvezvipingamupinyi zvekufunga nezvazvo.
Organic Solderability Preservative (OSP):
OSP inzira yekurapa pamusoro inosanganisira kupfekedza nzvimbo yemhangura neyakaonda firimu kuti isaite oxidizing. Iyi nzira inoenderana nenharaunda sezvo ichibvisa kudiwa kwesimbi dzinorema. OSP inopa nzvimbo yakati sandara uye yakanaka solderability, ichiita kuti ive yakakodzera kune yakanaka pitch zvikamu. Nekudaro, OSP ine hupenyu hushoma hwesherufu, inonzwisisa kubata, uye inoda mamiriro ekuchengetedza akakodzera kuchengetedza kushanda kwayo.
Immersion tin (ISn):
ISn inzira yekurapa pamusoro inosanganisira kunyudza dunhu rinochinjika mubhavhu remarata akanyungudutswa. Iyi nzira inoumba chidimbu cherata pamusoro pemhangura, iyo ine yakanakisa solderability, flatness uye corrosion resistance. ISn inopa yakatsetseka pamusoro pekupedzisira ichiita kuti ive yakanaka kune yakanaka pitch application. Nekudaro, ine kushomeka kwekudzivirira kupisa uye ingangoda kubatwa kwakakosha nekuda kwekuoma kwetin.
Electroplating (E plating):
Electroplating inzira yakajairwa yekurapa kwepamusoro mune inoshanduka redunhu kugadzira. Maitiro acho anosanganisira kuisa simbi yesimbi pamusoro pemhangura kuburikidza ne electrochemical reaction. Zvichienderana nezvinodiwa zvekushandisa, electroplating inowanikwa mune dzakasiyana sarudzo segoridhe, sirivheri, nickel kana tin plating. Inopa kusimba kwakanyanya, solderability uye corrosion resistance. Nekudaro, inodhura zvakanyanya kana ichienzaniswa nedzimwe nzira dzekurapa pamusoro uye inoda michina yakaoma uye zvidzoreso.
3.Precautions yekusarudza nzira chaiyo yekurapa pamusoro muFPC flex PCB kugadzira:
Kusarudza kupedzisa kwepamusoro kweFPC flexible circuits kunoda kunyatsotariswa kwezvinhu zvakasiyana-siyana sekushandisa, mamiriro ekunze, solderability zvinodiwa, uye mutengo-kushanda. Ichi chikamu chinopa nhungamiro pakusarudza nzira yakakodzera zvichienderana nemafungiro aya.
Ziva zvinodiwa nevatengi:
Usati wanyura mune akasiyana ekurapa epamusoro aripo, zvakakosha kuti uve nekunzwisisa kwakajeka kwezvinodiwa nevatengi. Funga nezvezvinhu zvinotevera:
Application:
Sarudza chinangwa chekushandiswa kweFPC yako inoshanduka PCB. Ndeyemagetsi evatengi, mota, zvekurapa kana zvemaindasitiri? Indasitiri yega yega inogona kunge iine zvinodiwa chaizvo, sekupokana nekupisa kwakanyanya, makemikari kana mechanical stress.
Environmental Conditions:
Ongorora mamiriro ezvakatipoteredza ayo PCB ichasangana nayo. Ichasangana nehunyoro, hunyoro, tembiricha yakanyanyisa kana zvinhu zvinopisa? Izvi zvinhu zvinopesvedzera nzira yekugadzirira kwepasi kuti ipe yakanakisa dziviriro kubva kune oxidation, corrosion uye kumwe kuparara.
Solderability zvinodiwa:
Ongorora zvinodikanwa zvekutengesa zveFPC inoshanduka PCB. Ko bhodhi richaenda kuburikidza neave wave soldering kana reflow soldering process? Kurapa kwakasiyana kwepamusoro kune kuenderana kwakasiyana neaya maitirwo ewelding. Kutora izvi kuchaita kuti avimbike solder majoini uye kudzivirira matambudziko akadai solderability kuremara uye anovhura.
Ongorora Nzira dzekurapa pamusoro pepamusoro:
Nekunzwisisa kwakajeka kwezvinodiwa nevatengi, inguva yekuongorora aripo epamusoro marapirwo:
Organic Solderability Preservative (OSP):
OSP inozivikanwa pamusoro pekurapa mumiriri weFPC inochinjika PCB nekuda kwekudhura kwayo uye maitiro ekuchengetedza kwezvakatipoteredza. Inopa ganda rakatetepa rinodzivirira rinodzivirira oxidation uye rinofambisa soldering. Zvisinei, OSP inogona kuva nedziviriro shoma kubva munzvimbo dzakaoma uye nehupenyu hupfupi pane dzimwe nzira.
Electroless Nickel Immersion Gold (ENIG):
ENIG inoshandiswa zvakanyanya mumaindasitiri akasiyana siyana nekuda kwekunaka kwayo solderability, corrosion resistance uye flatness. Iyo yegoridhe layer inovimbisa kubatana kwakavimbika, nepo nickel layer inopa yakanakisa oxidation kuramba uye hutsinye kuchengetedzwa kwezvakatipoteredza. Nekudaro, ENIG inodhura zvichienzaniswa nedzimwe nzira.
Electroplated Hard Gold (Hard Gold):
Goridhe rakaoma rinogara kwenguva refu uye rinopa kuvimbika kwekubatana, zvichiita kuti ive yakakodzera kune maapplication anosanganisira akadzokororwa kuisirwa uye yakakwirira kupfeka nharaunda. Nekudaro, ndiyo inodhura zvakanyanya kupedzisa sarudzo uye inogona kusadikanwa kune yega application.
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG):
ENEPIG ndeye multifunctional pamusoro pekurapa mumiririri akakodzera kune akasiyana maapplication. Iyo inosanganisa zvakanakira nickel uye goridhe zvidimbu pamwe nekuwedzera bhenefiti yepakati palladium layer, ichipa yakanakisa waya kusungirirwa uye corrosion kuramba. Nekudaro, ENEPIG inoita kunge inodhura uye yakaoma kugadzirisa.
4.Comprehensive Nhanho-ne-Nhanho Inotungamira kune Surface Kugadzirira Matanho muFPC flex PCB kugadzira:
Kuti uve nechokwadi chekuitwa kwakabudirira kwemaitiro ekugadzirira kwepamusoro, zvakakosha kutevedzera nzira yakarongeka. Ichi chikamu chinopa yakadzama nhanho-ne-nhanho gwara rinofukidza pretreatment, kemikari kuchenesa, flux application, pamusoro pekuvhara uye mushure mekurapa maitiro. Nhanho imwe neimwe inotsanangurwa zvakakwana, ichiratidza maitiro akakodzera uye maitiro akanaka.
Danho 1: Preprocessing
Pretreatment inhanho yekutanga mukugadzirira kwepamusoro uye inosanganisira kuchenesa nekubvisa kusvibiswa kwepamusoro.
Chekutanga ongorora pamusoro pane chero kukuvara, kusakwana kana ngura. Nyaya idzi dzinofanirwa kugadziriswa pasati paitwa rimwe danho. Tevere, shandisa mhepo yakamanikidzwa, bhurasho, kana vacuum kubvisa chero zvidimbu zvakasununguka, guruva, kana tsvina. Kuti uwedzere kusvibiswa kwetsvina, shandisa chinonyungudutsa kana kemikari chekuchenesa chakagadzirwa chakanangana nechinhu chepamusoro. Ita shuwa kuti nzvimbo yacho yakanyatso kuoma mushure mekuchenesa, sezvo hunyoro hwakasara hunogona kukanganisa maitiro anotevera.
Danho 2: Kuchenesa Kemikari
Kuchenesa makemikari kunosanganisira kubvisa chero tsvina yakasara kubva pamusoro.
Sarudza yakakodzera kemikari yekuchenesa yakavakirwa pamusoro pezvinhu uye rudzi rwekusvibiswa. Isa kuchenesa zvakaenzana kumusoro uye bvumira yakakwana yekubata nguva yekubvisa zvinobudirira. Shandisa bhurashi kana pedhi yekukwesha zvinyoro nyoro pamusoro, uchiteerera kune dzakaoma-kusvika-nzvimbo. Sukurudza pasi zvakakwana nemvura kuti ubvise chero chasara chemuchenesi. Iyo kemikari yekuchenesa maitiro inovimbisa kuti nzvimbo yacho yakanyatso kuchena uye yakagadzirira kunotevera kugadzirisa.
Danho rechitatu: Flux Application
Iko kushandiswa kweflux kwakakosha kune brazing kana soldering process sezvo inosimudzira kunamatira zvirinani uye inoderedza oxidation.
Sarudza iyo yakakodzera flux mhando zvinoenderana nezvinhu zvinofanirwa kubatanidzwa uye chaiwo maitiro ezvinodiwa. Isa flux zvakaenzana kunzvimbo yekubatana, kuve nechokwadi chekuvhara kwakakwana. Chenjerera kuti usashandise yakawandisa flux nekuti inogona kukonzera matambudziko ekusodha. Flux inofanira kuiswa pakarepo pamberi pekutengesa kana kutengesa nzira kuti ichengetedze kushanda kwayo.
Nhanho 4: Surface Coating
Kupfeka kwepamusoro kunobatsira kuchengetedza nzvimbo kubva kumamiriro ekunze, kudzivirira ngura uye kuwedzera chitarisiko chavo.
Usati washandisa kuvhara, gadzirira maererano nemirairo yemugadziri. Isa jasi racho nekungwarira uchishandisa brashi, roller kana sprayer, kuve nechokwadi chekuvhara uye yakatsetseka. Cherechedza kuomeswa kwakakurudzirwa kana kupora nguva pakati pemajasi. Kuti uwane mhedzisiro yakanaka, chengetedza yakakodzera mamiriro ezvakatipoteredza senge tembiricha uye humidity mwero panguva yekurapa.
Danho 5: Post-processing maitiro
Iyo mushure mekurapa maitiro akakosha kuti ave nechokwadi chehupenyu hurefu hwekuputira pamusoro uye huwandu hwese hwepamusoro hwakagadzirirwa.
Mushure mekuvhara kwakanyatsorapwa, tarisa kune chero kusakwana, mabhubhu kana kusaenzana. Gadzirisa matambudziko aya nejecha kana kupukuta pamusoro, kana zvichidikanwa. Kugara uchigadzirisa uye kuongororwa kwakakosha kuti uone chero zviratidzo zvekupfeka kana kukuvadzwa mujasi kuitira kuti igone kugadzirwa nekukurumidza kana kushandiswa zvakare kana zvichidikanwa.
5.Quality Kudzora uye Kuedzwa muFPC flex PCB yekugadzira pamusoro pekurapa maitiro:
Kudzora kwemhando uye kuyedzwa kwakakosha kuti uone kushanda kwemaitiro ekugadzirira kwepamusoro. Ichi chikamu chichakurukura nzira dzakasiyana dzekuyedza, dzinosanganisira kuongorora kwekuona, kuyedzwa kwekunamatira, kuyedza solderability, uye kuvimbika kuyedzwa, kuve nechokwadi chakaenderana uye kuvimbika kwekugadzira-yakagadziriswa FPC Flex PCBs.
Kuongorora kwekuona:
Kuongorora kwekuona inhanho yakakosha asi yakakosha mukutonga kwemhando. Inosanganisira nekuona kutarisa pamusoro pePCB kune chero hurema hwakadai sekukwenya, oxidation kana kusvibiswa. Ongororo iyi inogona kushandisa michina yekuona kana microscope kuona chero zvisizvo zvingakanganisa kuita kwePCB kana kuvimbika.
Adhesion Testing:
Adhesion bvunzo inoshandiswa kuongorora kusimba kwekunamatira pakati pekurapwa kwepamusoro kana kukoira uye pasi pe substrate. Muedzo uyu unova nechokwadi chekuti kupedzisa kwakanyatso kusungirirwa kuPCB, kudzivirira chero nguva isati yakwana delamination kana peeling. Zvichienderana nezvinodiwa uye zviyero, nzira dzakasiyana dzekuyedza dzekunamatira dzinogona kushandiswa, senge tepi yekuyedza, kukwenya kuyedzwa kana kudhonza kuyedzwa.
Solderability Testing:
Solderability bvunzo inosimbisa kugona kwepamusoro kurapwa kufambisa maitiro ekutengesa. Muedzo uyu unovimbisa kuti PCB yakagadziriswa inokwanisa kugadzira majoini akasimba uye akavimbika ekutengesa ane zvigadzirwa zvemagetsi. Yakajairika solderability yekuyedza nzira dzinosanganisira solder kuyerera kuyedza, solder wetting chiyero kuyedzwa, kana solder bhora kuyerwa kuyerwa.
Kuvimbika Kuedzwa:
Kuvimbika kuyedzwa kunoongorora kushanda kwenguva refu uye kusimba kwepamusoro-yakarapwa FPC Flex PCBs pasi pemamiriro akasiyana. Muedzo uyu unogonesa vagadziri kuti vaongorore kuramba kwePCB kune tembiricha bhasikoro, humidity, corrosion, mechanical stress, uye zvimwe zvakatipoteredza. Kukurumidza kuyedza hupenyu uye kuyedza kuenzanisa kwezvakatipoteredza, senge kupisa bhasikoro, munyu kupfapfaidza kuyedzwa kana vibration kuyedzwa, zvinowanzo shandiswa kuvimbika kuongorora.
Nekushandisa yakazara kudzora kwemhando uye maitiro ekuyedza, vagadziri vanogona kuona kuti pamusoro-yakarapwa FPC Flex PCBs inoteerana nezvinodiwa uye zvakatemwa. Matanho aya anobatsira kuona chero hurema kana kusawirirana pakutanga kwemaitiro ekugadzira kuitira kuti zviito zvekugadzirisa zvigone kutorwa nenguva uye kuvandudza huwandu hwechigadzirwa uye kuvimbika.
6.Kugadzirisa matambudziko ekugadzirira kwepamusoro muFPC flex PCB kugadzira:
Nyaya dzekurapa kwepamusoro dzinogona kuitika panguva yekugadzira, zvichikanganisa huwandu hwese uye kuita kweFPC inoshanduka PCB. Ichi chikamu chinozivisa zvakajairika nyaya dzekugadzirira pamusoro uye nekupa matipi ekugadzirisa matambudziko kuti akunde zvine hungwaru matambudziko aya.
Yakashata Adhesion:
Kana iyo yekupedzisira isinganamati nemazvo kuPCB substrate, inogona kukonzera delamination kana peeling. Izvi zvinogona kunge zvichikonzerwa nekuvapo kwezvinosvibisa, kusakwana kwehushasha hwepamusoro, kana kusakwana kwekushanda kwepamusoro. Kuti urwise izvi, ita shuwa kuti nzvimbo yePCB yanyatsocheneswa kubvisa chero kusvibiswa kana zvakasara usati wabata. Pamusoro pezvo, wedzera kushata kwepamusoro uye ive nechokwadi chekuti nzira dzekuita dzepamusoro, dzakadai sekurapa kweplasma kana kemikari activation, dzinoshandiswa kuwedzera kunamatira.
Kupfeka zvisina kuenzana kana plating ukobvu:
Kusaenzana kupfekedza kana plating ukobvu kunogona kuve mhedzisiro yekusakwana kudzora maitiro kana kusiyanisa kwekuoma kwepasi. Dambudziko iri rinokanganisa mashandiro uye kuvimbika kwePCB. Kuti ukunde dambudziko iri, gadza uye utarise akakodzera maitiro paramita senge yekuputira kana plating nguva, tembiricha uye kugadzirisa kugadzirisa. Dzidzira kwakaringana kubvongodza kana kubvongodza nzira panguva yekuputira kana plating kuti uve nechokwadi chekugovaniswa kwakafanana.
Oxidation:
MaPCB akabatwa nepamusoro-soro anogona kuita oxidize nekuda kwekusangana nehunyoro, mhepo, kana zvimwe zvinokonzeresa oxidizing agents. Oxidation inogona kutungamira mukusagadzikana solderability uye kuderedza kuita kwese kwePCB. Kudzikamisa oxidation, shandisa akakodzera epamusoro marapirwo senge organic coatings kana ekudzivirira mafirimu kupa chipingamupinyi pakunyorova uye oxidizing agents. Shandisa mabatiro akakodzera uye maitirwo ekuchengetedza kuti uderedze kusangana nemhepo uye mwando.
Kusvibiswa:
Kusvibiswa kwePCB pamusoro kunogona kukanganisa kunamatira uye solderability yekupedzisa kwepamusoro. Zvakajairwa zvinosvibisa zvinosanganisira guruva, mafuta, zvigunwe, kana zvakasara kubva kune zvakapfuura maitiro. Kuti urwise izvi, gadzira chirongwa chekuchenesa chinoshanda kuti ubvise chero tsvina isati yagadzirwa. Shandisa nzira dzakakodzera dzekurasa kuderedza kubata-maoko kana zvimwe zvinosvibisa.
Poor Solderability:
Kusaita solderability kunogona kukonzerwa nekushaikwa kwepamusoro activation kana kusvibiswa paPCB pamusoro. Kusaita solderability kunogona kutungamirira kune weld defects uye majoini asina simba. Kuti uvandudze solderability, ita shuwa nzira dzekuita dzepamusoro dzakadai sekurapa kweplasma kana kemikari activation dzinoshandiswa kuwedzera kunyorova kwePCB. Zvakare, ita chirongwa chekuchenesa chinoshanda kuti ubvise chero zvinosvibisa zvinogona kukanganisa maitiro ekuchenesa.
7. Kuvandudzwa kweramangwana reFPC flex board kugadzira pamusoro pekurapa:
Munda wekupedzisa kwepamusoro kweFPC inoshanduka PCBs inoramba ichishanduka kuti isangane nezvinodiwa tekinoroji uye maapplication ari kubuda. Ichi chikamu chichakurukura zvingangoitika mune ramangwana nzira dzekurapa dzepamusoro senge zvinhu zvitsva, matekinoroji ekunamira epamusoro, uye mhinduro dzinoenderana nenharaunda.
Iyo inogona kusimudzira mune ramangwana reFPC yekurapa kwepamusoro iko kushandiswa kwezvinhu zvitsva zvine zvivakwa zvakasimudzirwa.Vatsvagiri vari kuongorora mashandisirwo emanovel coatings uye zvinhu kuvandudza mashandiro uye kuvimbika kweFPC inoshanduka PCBs. Semuenzaniso, machira ekuzvirapa ari kuongororwa, anogona kugadzirisa chero kukuvara kana kukwenya pamusoro pePCB, nekudaro kuwedzera hupenyu hwayo uye kusimba. Pamusoro pezvo, zvishandiso zvine yakagadziridzwa kupisa conductivity zviri kuongororwa kuti iwedzere kugona kweFPC kudzima kupisa kuti iite zvirinani mumashandisirwo ekupisa kwepamusoro.
Imwe budiriro yeramangwana kufambira mberi kwehunyanzvi hwekupfeka matekinoroji.Nzira itsva dzekupfekedza dziri kugadzirwa kuti dzipe kunyatsojeka uye kuvharika kwakafanana pane zveFPC. Matekinoroji akadai seAtomic Layer Deposition (ALD) uye Plasma Enhanced Chemical Vapor Deposition (PECVD) inobvumira kudzora kurinani kwehukukutu hwekufukidzira uye kuumbwa, zvichikonzera kuvandudza solderability uye kunamatira. Aya matekinoroji epamusoro ekupfekedza zvakare ane mukana wekudzikisa kusiana kwemaitiro uye kuvandudza kugona kwekugadzira kwese.
Mukuwedzera, kune kuwedzera kusimbiswa kune zvakatipoteredza nepamusoro pekugadzirisa kugadzirisa mhinduro.Nemirau inoramba ichiwedzera uye kunetsekana pamusoro pekukanganisa kwezvakatipoteredza kwechinyakare nzira dzekugadzirira pamusoro, vaongorori vari kutsvaga yakachengeteka, inogoneka imwe mhinduro. Semuenzaniso, mabhanhire emvura ari kuwana mukurumbira nekuda kwekushomeka kwawo kwakadzika kwe organic compound (VOC) kana zvichienzaniswa nemabhatiri anotakurwa nesolvent. Pamusoro pezvo, kuedza kuri kuenderera mberi kuvandudza magariro etching etching ayo asingaburitse chepfu kubva-zvigadzirwa kana tsvina.
Kupedzisa,iyo nzira yekurapa yepamusoro inoita basa rakakosha mukuona kuvimbika uye kuita kweFPC nyoro bhodhi. Nekunzwisisa kukosha kwekugadzirira kwepamusoro uye kusarudza nzira yakakodzera, vagadziri vanogona kugadzira yakakwirira-yemhando inochinjika maseketi inosangana nezvinodiwa zvemaindasitiri akasiyana. Kuita yakarongeka yekurapa kwepamusoro maitiro, kuita bvunzo dzemhando yepamusoro, uye kunyatsogadzirisa nyaya dzekurapa kwepamusoro zvinozobatsira mukubudirira uye hupenyu hurefu hweFPC inoshanduka PCB mumusika.
Nguva yekutumira: Sep-08-2023
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