Nhanganyaya: Matambudziko Ehunyanzvi muMotokari Yemagetsi uyeCapel's Innovations

Sezvo kutyaira kwakazvimiririra kunoshanduka kuenda kuL5 uye mota yemagetsi (EV) bhatiri manejimendi masisitimu (BMS) inoda yakakwira simba density uye kuchengetedzeka, echinyakare PCB matekinoroji anonetsekana kugadzirisa nyaya dzakakomba:

• Thermal Runaway Risks: ECU chipsets inodarika 80W simba rekushandisa, ine tembiricha yemuno inosvika 150 ° C
• 3D Integration Limits: BMS inoda 256+ masaini chiteshi mukati me 0.6mm bhodhi ukobvu
• Vibration Kukundikana: Autonomous sensors inofanira kumira 20G mechanical shocks
• Miniaturization Inoda: LiDAR controllers inoda 0.03mm trace wides uye 32-layer stacking

Capel Tekinoroji, inosimudzira 15 makore eR&D, inosuma inoshandura mhinduro kusanganisahigh thermal conductivity PCBs(2.0W/mK),high-temperature resistant PCBs(-55°C~260°C),uye32-layerHDI yakavigwa/bofu kuburikidza nehunyanzvi(0.075mm microvias).

Chikamu 1: Thermal Management Revolution yeAutonomous Driving ECUs

1.1 ECU Thermal Matambudziko

• Nvidia Orin chipset kupisa flux density: 120W/cm²
• Zvakajairika FR-4 substrates (0.3W/mK) zvinokonzeresa 35% chip junction tembiricha yakawandisa
• 62% yeECU kukundikana kunobva pakupisa kwekushushikana-induced solder kuneta

1.2 Capel's Thermal Optimization Technology

Material Innovations:

• Nano-aluminium yakasimbiswa polyimide substrates (2.0±0.2W/mK thermal conductivity)
• 3D copper pillar arrays (400% yakawedzera kupisa kupisa nzvimbo)

Maitiro Akabudirira:

• Laser Direct Structuring (LDS) yekugadziridza nzira dzekupisa
• Hybrid stacking: 0.15mm Ultra-yakaonda mhangura + 2oz inorema mhangura zvidimbu

Kuenzanisa Kwekuita:

Chikamu 2: BMS Wiring Revolution ine 32-Layer HDI Technology

2.1 Indasitiri Pain Points muBMS Dhizaini

• 800V mapuratifomu anoda 256+ masero emagetsi ekutarisa chiteshi
• Magadzirirwo akajairwa anodarika miganhu yenzvimbo ne200% ne15% impedance mismatch

2.2 Capel's High-Density Interconnect Solutions

Stackup Engineering:

• 1+N+1 chero-layer HDI chimiro (32 layers pa 0.035mm ukobvu)
• ± 5% musiyano we impedance control (10Gbps high-speed signals)

Nhoroondo ye Microvia Technology:

• 0.075mm laser-blind vias (12:1 chikamu chiyero)
• <5% plating void rate (IPC-6012B Kirasi 3 inoenderana)

Benchmark Results:

Chikamu 3: Kuvimbika Kwakanyanya Kwenzvimbo - MIL-SPEC Certified Solutions

3.1 High-Temperature Material Performance

• Glass Transition Temp (Tg): 280°C (IPC-TM-650 2.4.24C)
• Decomposition Temp (Td): 385°C (5% kurasikirwa uremu)
• Thermal Shock Kupona: 1,000 cycles (-55°C↔260°C)

3.2 Proprietary Protection Technologies

• Plasma-yakabatanidzwa polymer coating (1,000h munyu pfapfaidzo kuramba)
• 3D EMI inodzivirira makomba (60dB attenuation @10GHz)

Chikamu 4: Nyaya Yekudzidza - Kudyidzana neGlobal Pamusoro 3 EV OEM

4.1 800V BMS Kudzora Module

• Dambudziko: Batanidza 512-chiteshi AFE mu85×60mm nzvimbo
• Solution:
  1. 20-layer rigid-flex PCB (3mm bend radius)
  2. Yakamisikidzwa tembiricha sensor network (0.03mm trace upamhi)
  3. Localized metal-core cooling (0.15°C·cm²/W thermal resistance)

4.2 L4 Autonomous Domain Controller

• Mhinduro:
  • 40% kuderedza simba (72W → 43W)
  • 66% saizi kuderedza maringe nemagadzirirwo akajairwa
  • ASIL-D inoshanda kuchengetedza chitupa

Chikamu 5: Zvitupa uye Hunhu Husimbiso

Capel's quality system inodarika zviyero zvemotokari:

• MIL-SPEC Certification: Inoenderana neGJB 9001C-2017
• Automotive Compliance: IATF 16949: 2016 + AEC-Q200 kusimbiswa
• Kuvimbika Testing:
  • 1,000h HAST (130°C/85% RH)
  • 50G mechanical shock (MIL-STD-883H)

Mhedziso: Inotevera-Gen PCB Technology Roadmap

Capel ari kupayona:

• Embedded passive components (30% nzvimbo yekuchengetedza)
• Optoelectronic hybrid PCBs (0.2dB/cm kurasikirwa @850nm)
• AI-inofambiswa neDFM masisitimu (15% goho kuvandudzwa)

Bata timu yedu yeinjiniyanhasi kubatanidza-kugadzira yakagadziridzwa PCB mhinduro kune yako inotevera-gen mota dzemagetsi.