Multilayer flexible printed circuit boards (FPC PCBs) zvinhu zvakakosha zvinoshandiswa mumhando dzakasiyana dzemidziyo yemagetsi, kubva kumafoni uye mahwendefa kuenda kumidziyo yekurapa uye masisitimu emotokari. Iyi tekinoroji yepamberi inopa kuchinjika kukuru, kusimba uye kufambiswa kwemasaini kwakanaka, zvichiita kuti itsvakwe zvakanyanya munyika yanhasi inomhanya-mhanya yedhijitari.Mune ino blog positi, isu tichakurukura izvo zvikuru zvikamu zvinogadzira multilayer FPC PCB uye kukosha kwavo mukushandisa zvemagetsi.
1. Flexible substrate:
Flexible substrate ndiyo hwaro hwe multilayer FPC PCB.Inopa kuchinjika kunodiwa uye kutendeseka kwemuchina kutsungirira kukotama, kupeta uye kumonyoroka pasina kukanganisa kuita kwemagetsi. Kazhinji, polyimide kana polyester zvinhu zvinoshandiswa seyakadzika substrate nekuda kwekugadzikana kwayo kwemafuta, kuvharwa kwemagetsi, uye kugona kubata kune simba kufamba.
2. Conductive layer:
Conductive layers ndiwo akanyanya kukosha zvikamu zve multilayer FPC PCB nekuti anofambisa kuyerera kwemasaini emagetsi mudunhu.Aya akaturikidzana anowanzo gadzirwa nemhangura, iyo ine yakanakisa conductivity yemagetsi uye kusagadzikana kwekuora. Iyo foil yemhangura yakashongedzwa kune inochinjika substrate uchishandisa adhesive, uye inotevera etching maitiro inoitwa kuti igadzire inodiwa yedunhu pateni.
3. Insulation layer:
Insulating layers, inozivikanwawo se dielectric layers, inoiswa pakati pemaconductive layers kudzivirira mapfupi emagetsi uye kupa kuparadzaniswa.Iwo akagadzirwa nezvinhu zvakasiyana senge epoxy, polyimide kana solder mask, uye ane yakakwira dielectric simba uye kugadzikana kwekupisa. Aya mataira anoita basa rakakosha mukuchengetedza chiratidzo chekuvimbika uye kudzivirira crosstalk pakati pepedyo conductive traces.
4. Solder mask:
Solder mask chigadziko chekudzivirira chinoshandiswa kune conductive uye insulating layers inodzivirira mapfupi maseketi panguva yekutengesa uye inodzivirira zviteshi zvemhangura kubva kune zvakatipoteredza zvakaita seguruva, hunyoro, uye oxidation.Kazhinji dzine ruvara rwegirinhi asi dzinogonawo kuuya mune mamwe mavara akadai setsvuku, bhuruu kana dema.
5. Kufukidzira:
Coverlay, inozivikanwawo seyevhavha firimu kana yekuvhara firimu, inodzivirira inoiswa kune yekunze pamusoro peakawanda-layer FPC PCB.Inopa kuwedzera kuvharidzira, kudzivirira kwemuchina uye kuramba kune unyoro uye zvimwe zvinosvibisa. Mavhavha anowanzo ane mazaru ekuisa zvinhu uye anobvumira kupinda nyore kumapadhi.
6. Copper plating:
Copper plating inzira ye electroplating chidimbu chitete chemhangura pane conductive layer.Maitiro aya anobatsira kuvandudza magetsi conductivity, yakaderera impedance, uye inosimudzira iyo yakazara dhizaini kutendeseka kweakawanda FPC PCBs. Copper plating zvakare inofambisa zvakanaka-pitch trace yeyakakwira-density maseketi.
7. Vias:
A via igomba diki rakaboorwa nepakati pemaconductive layers e-multi-layer FPC PCB, achibatanidza rimwe chete kana kupfuura pamwe chete.Ivo vanobvumira vertical yekubatanidza uye inogonesa chiratidzo chekufambisa pakati pezvikamu zvakasiyana zvedunhu. Vias inowanzozadzwa nemhangura kana conductive paste kuti ive nechokwadi chekubatana kwemagetsi.
8. Mapedhi echikamu:
Component pads inzvimbo dziri pane multilayer FPC PCB dzakarongedzerwa kubatanidza zvinhu zvemagetsi senge resistors, capacitors, integrated circuits, uye connectors.Aya mapadhi anowanzo gadzirwa nemhangura uye akabatanidzwa kune ari pasi conductive traces uchishandisa solder kana conductive adhesive.
Muchidimbu:
A multilayer inochinjika yakadhindwa yedunhu bhodhi (FPC PCB) chimiro chakaomarara chinoumbwa neakati wandei ekutanga zvikamu.Flexible substrates, conductive layers, insulating layer, solder masks, overlays, copper plating, vias uye component pads zvinoshanda pamwechete kuti zvipe inodiwa yekubatanidza magetsi, kushanduka kwemagetsi uye kusimba kunodiwa nemagetsi emazuva ano. Kunzwisisa zvinhu zvikuru izvi kunobatsira mukugadzira uye kugadzira emhando yepamusoro multilayer FPC PCBs inosangana nezvinodiwa zvakaomarara zvemaindasitiri akasiyana.
Nguva yekutumira: Sep-02-2023
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