Molding Ceramic Circuit Board Substrates:Iyo nzira dzinonyanya kushandiswa

Mune ino blog post, isu tichatarisa nzira dzinowanzo shandiswa kuumba ceramic redunhu bhodhi substrates.

Kuumbwa kweceramic circuit board substrates inzira yakakosha mukugadzirwa kwemidziyo yemagetsi. Ceramic substrates ine yakanakisa yekudziya kugadzikana, yakakwira mechanical simba uye yakaderera kupisa kwekuwedzera, zvichiita kuti ive yakakodzera kune maapplication akadai semagetsi emagetsi, tekinoroji yeLED uye mota dzemagetsi.

1. Kuumba:

Kuumba ndiyo imwe yedzakanyanya kushandiswa nzira dzekugadzira ceramic redhisheni bhodhi substrates. Zvinosanganisira kushandisa hydraulic press kudzvanya ceramic poda kuita chimiro chakafanotemerwa. Iyo poda inotanga yakasanganiswa nemabhaidhi uye zvimwe zvinowedzera kuti ivandudze kuyerera kwayo uye plastiki. Musanganiswa unozodururwa mugomba reforoma uye kudzvanywa kunoiswa kubatanidza hupfu. Iyo compact compact inobva yasiiwa patembiricha yakakwira kubvisa binder uye fuse zvidimbu zveceramic pamwe chete kuti zvigadzire substrate yakasimba.

2. Kukandira:

Kukandira tepi ndiyo imwe nzira yakakurumbira yeceramic circuit board substrate kuumba, kunyanya kune matete uye anochinjika substrates. Nenzira iyi, slurry ye ceramic powder uye solvent inopararira pane imwe nzvimbo yakadzika, yakadai sefirimu repurasitiki. Chiremba blade kana roller inobva yashandiswa kudzora kukora kweslurry. Iyo inonyungudika inoputika, ichisiya tepi yakaonda yakasvibira, iyo inogona kubva yachekwa kuita yaunoda chimiro. Iyo tepi yegirini inozosiiwa kuti ibvise chero yasara solvent uye binder, zvichikonzera dense ceramic substrate.

3. Jekiseni molding:

Jekiseni molding rinowanzo shandiswa kuumba epurasitiki zvikamu, asi inogona zvakare kushandiswa kune ceramic circuit board substrates. Iyo nzira inosanganisira kubaya majekiseni eramic poda yakasanganiswa nebhainda mugomba rekuumbwa pasi pekumanikidzwa kukuru. Iyo mold inozopisa kuti ibvise binder, uye mhedzisiro yegirini muviri unopiswa kuti uwane yekupedzisira ceramic substrate. Jekiseni molding inopa zvakanakira kukurumidza kugadzira kukurumidza, yakaoma chikamu geometries uye yakanakisa dimensional kurongeka.

4. Extrusion:

Extrusion molding inonyanya kushandiswa kugadzira ceramic circuit board substrates ine yakaoma muchinjiko-chikamu maumbirwo, senge machubhu kana masilinda. Maitiro acho anosanganisira kumanikidza plasticized ceramic slurry kuburikidza neforoma ine chimiro chaunoda. Paste yacho inochekwa kuita hurefu hwaidiwa uye woomeswa kubvisa chero mwando wasara kana zvinonyungudutsa. Iyo yakaomeswa yakasvibira zvikamu zvinobva zvadzingwa kuti uwane yekupedzisira ceramic substrate. Extrusion inogonesa kuenderera mberi kwekugadzirwa kwema substrates ane zviyero zvinowirirana.

5. 3D kudhinda:

Nekuuya kweiyo yekuwedzera yekugadzira tekinoroji, 3D kudhinda kuri kuita nzira inoshanda yekuumba ceramic circuit board substrates. Muceramic 3D kudhinda, ceramic poda inosanganiswa nebhainda kugadzira paste inodhinda. Iyo slurry inozoiswa layer ne layer, ichitevera dhizaini yakagadzirwa nekombuta. Mushure mekudhinda, zvikamu zvakasvibirira zvinopiswa kuti zvibvise bhainda uye kusanganisa zvimedu zveceramic pamwe chete kuita substrate yakasimba. 3D kudhinda kunopa yakakura dhizaini kuchinjika uye inogona kugadzira yakaoma uye yakasarudzika ma substrates.

Muchidimbu

Iko kuumbwa kweceramic redunhu bhodhi substrates kunogona kupedzwa nenzira dzakasiyana-siyana senge kuumba, kukanda tepi, jekiseni kuumba, extrusion uye 3D kudhinda. Imwe neimwe nzira ine zvayakanakira, uye sarudzo yakavakirwa pazvinhu zvakaita sechinodiwa chimiro, throughput, kuoma, uye mutengo. Sarudzo yekugadzira nzira inozopedzisira yaona kunaka uye kuita kweceramic substrate, zvichiita kuti ive nhanho yakakosha mukugadzira zvigadzirwa zvemagetsi.