Gadzirisa mhando yechiratidzo mu12-layer PCBs kuderedza crosstalk

Kugadzirisa Kufambisa uye Interlayer Kubatanidza Matambudziko mu12-Layer Circuit Boards kuti Uwane Yakanyanya Chiratidzo Chiratidzo Hunhu uye Kuderedza Crosstalk.

suma:

Kukurumidza kufambira mberi mune tekinoroji kwakakonzera kuwedzera kwekudiwa kwemidziyo yakaoma yemagetsi, zvichikonzera kushandiswa kwema-multi-layer circuit board. Aya mabhodhi ane akati wandei akaturikidzana emitambo yekufambisa, achipa compact uye inoshanda mhinduro yemagetsi masisitimu. Nekudaro, sezvo kuoma kwemabhodhi aya kunowedzera, matambudziko akasiyana anomuka, senge nzira uye interlayer nyaya dzekubatanidza. Mune ino blog, isu tichanyura mukati mekuoma kwekugadzirisa matambudziko aya mumabhodhi gumi nemaviri edunhu kuti tiwane yakaderera crosstalk uye yakakwirira chiratidzo chemhando. Saka ngatinyure mukati!

Nzwisisa matambudziko e-cabling:

Kushanda cabling kwakakosha kuti uve nechokwadi chekufambisa kwemasaini uye kuderedza kupindira. Mune 12-layer redunhu bhodhi, iyo denser trace dhizaini inowedzera zvakanyanya kuoma kweiyo nzira yekufambisa. Heano mamwe maitiro akakosha ekukunda dambudziko iri:

1. Isa zvinhu zvakanyatsonaka:

Kuiswa kunofunga kwechikamu kunoita basa rakakosha mukugadzirisa nzira. Nekuronga zvikamu zvine musoro, tinogona kuderedza kureba kwewaya uye kuderedza mukana wekuyambuka. Tarisa pakudzikisa chinhambwe pakati pezvinhu zvakakosha kuti uve nechokwadi chekuyerera kwechiratidzo.

2. Shandisa chiratidzo chechiratidzo nehungwaru:

Nehungwaru kugovera masaga echiratidzo kunobatsira kuchengetedza kutendeseka kwechiratidzo. Kukanganisika kunogona kudzikiswa nekuisa masaini masaini pamwechete mumatanho ari pedyo uye nekupa nzvimbo yakaringana pakati pezviratidzo zvinonzwisisika. Pamusoro pezvo, kushandisa pasi uye ndege dzemagetsi mukati mebhodhi kunobatsira kudzora kukanganiswa kwemagetsi (EMI) uye kuderedza kushanduka kwemagetsi.

3. Signal layer routing:

Kufambisa masaini nekungwarira kwakakosha kudzivirira crosstalk. Shandisa mapeya akasiyana kana anodzorwa impedance traces yeakakwira frequency masaini. Kushandisa nzira dzekudzivirira, dzakadai sekubatanidza ndege dzepasi pakati pezvikamu zvezviratidzo, zvinogona kupa imwe nhanho yekudzivirira kubva pakuyambuka-kubatanidzwa uye ruzha rwakanyanya.

4. Chiratidzo chekuvimbika uye mitemo yekugadzira:

Kutevedzera kutendeseka kwechiratidzo uye mitemo yekugadzira kwakakosha kuti uwane yakanakisa chiratidzo chemhando. Ita yakakwana impedance kuverenga uchifunga nezve hunhu hwe substrate uye zvipingamupinyi zvekugadzira. Ita shuwa kumisa kwakaringana uye impedance yekufananidza kudzivirira masaini kuratidza uye huwori hwedata.

Gadzirisa dambudziko rekubatanidza-layer:

Pamusoro pezvipingamupinyi zvenzira, kuve nechokwadi chekubatanidza interlayer kwakakosha zvakaenzana pakugadzirisa mhando yechiratidzo. Ngationgororei mamwe matekiniki ekugadzirisa iyo inter-layer yekubatanidza dambudziko:

1. Kuburikidza nenzvimbo:

Strategically positioned vias inogonesa kuyerera kwechiratidzo pakati pezvikamu. Kuisa vias padhuze nekwainobva chiratidzo uye kwekuenda kunoderedza mukana wekuyambuka uye kuderedzwa kwechiratidzo. Bofu kana kuvigwa vias zvinowedzera kuwedzera kutendeseka kwechiratidzo nekubvumira zvinongedzo kune zvakati zvidimbu pasina kupinda mubhodhi rose.

2. Deredza kuburikidza ne stubs:

Via stubs inogona kukonzeresa kuderedzwa kwechiratidzo, kunyanya pamhepo huru. Nekudzikisa hurefu hwema stubs, tinogona kuderedza kutarisisa uye kurasikirwa kwechiratidzo. Matekinoroji akasiyana akadai sekumashure uye microdrilling anogona kubatsira kubvisa kana kudzikisa hurefu hwe stub.

3. Inodzorwa impedance nzira:

Kuwana inodzorwa impedance pakati peakasiyana akaturikidzana kwakakosha kuchengetedza chiratidzo chekuvimbika. Yakaomesesa impedance kuverenga uye nekuchenjerera kutevedza nzira inogonesa inopindirana impedance hunhu mukati mese interlayer yekubatanidza, ichideredza kukanganiswa kwechiratidzo.

4. Yakaturikidzana dhizaini:

Kunyatsofunga nezve stack-up dhizaini inogona kudzikisira inter-layer yekubatanidza matambudziko. Sarudza symmetrical stackup uchishandisa angave prepreg layer kana symmetrically positioned dielectric layer. Nekugovera zvinhu kwakaringana, chero chiratidzo chinopfuura nepachikamu chimwe nechimwe chinosangana nemamiriro akafanana, kuve nechokwadi chechiratidzo chemhando yebhodhi rese.

Mukupedzisa:

Kukura kuri kudiwa kwezvishandiso zvemagetsi zvemhando yepamusoro zvinoda kushandiswa kweakawanda-akaturikidzana uye akaomarara edunhu mabhodhi. Nekudaro, kugadzirisa iyo routing uye inter-layer yekubatanidza matambudziko mumabhodhi aya akaomarara kwakakosha kuti uwane yakaderera crosstalk uye yakakwirira chiratidzo chemhando. Nekunyatsoisa zvikamu, zvine hungwaru kushandiswa kwemasaini masendimita, kushandisa nzira inobudirira, uye nekutarisa yakakwana yekubatanidza interlayer, tinogona kukunda matambudziko aya uye tive nechokwadi chekushanda kwakakwana kubva ku12-layer circuit board. Shandisa mazano aya kutora dhizaini yako yemagetsi kune hurefu hutsva hwekubudirira!