Simudzira PCB yako yekugadzira: sarudza iyo yakakwana kupedzisa kune yako 12-layer board

Mune ino blog, isu tichakurukura mamwe akakurumbira epamusoro marapirwo uye mabhenefiti awo ekukubatsira kukwidziridza yako 12-layer PCB yekugadzira maitiro.

Mumunda wemagetsi maseketi, akadhindwa edunhu mabhodhi (PCBs) anoita basa rakakosha mukubatanidza uye kupa masimba akasiyana emagetsi zvikamu. Sezvo tekinoroji ichifambira mberi, kudiwa kwemamwe maPCB epamberi uye akaomarara anowedzera zvakanyanya. Naizvozvo, kugadzira PCB kwave danho rakakosha mukugadzira zvemhando yepamusoro zvemagetsi.

Chinhu chakakosha chekufunga panguva yekugadzira PCB kugadzirira kwepamusoro.Kurapa kwepamusoro kunoreva kuvhara kana kupedzisa kwakaiswa kuPCB kuidzivirira kubva kune zvakatipoteredza zvinhu uye kuwedzera kushanda kwayo. Kune akasiyana siyana epamusoro ekurapa sarudzo anowanikwa, uye kusarudza iyo yakakwana kurapwa kune yako 12-layer board inogona kukanganisa zvakanyanya kuita kwayo uye kuvimbika.

1.HASL (mhepo inopisa solder leveling):
HASL inzira inoshandiswa nevakawanda pamusoro pekurapa iyo inosanganisira kunyudza PCB mune yakanyungudutswa solder uyezve kushandisa mhepo inopisa banga kubvisa yakawandisa solder. Iyi nzira inopa inodhura-inoshanda mhinduro ine yakanakisa solderability. Zvisinei, ine zvimwe zvinogumira. Iyo solder haigone kugoverwa zvakaenzana pamusoro pepamusoro, zvichikonzera kupera kusina kuenzana. Uye zvakare, kuratidzwa kwekushisa kwakanyanya panguva yekuita kunogona kukonzera kushushikana kwekupisa paPCB, zvichikanganisa kuvimbika kwayo.

2. ENIG (electroless nickel immersion gold):
ENIG isarudzo yakakurumbira yekurapa kwepamusoro nekuda kwekunaka kwayo weldability uye flatness. Muchirongwa che ENIG, chidimbu chitete chenickel chinoiswa pamusoro pemhangura, chichiteverwa nechidimbu chegoridhe. Kurapa uku kunovimbisa kumira zvakanaka kweoxidation uye kunodzivirira kuparara kwemhangura. Pamusoro pezvo, kugovaniswa kwakafanana kwegoridhe pamusoro pepamusoro kunopa nzvimbo yakati sandara uye yakatsetseka, ichiita kuti ive yakakodzera kune-yakanaka-pitch zvikamu. Nekudaro, ENIG haikurudzirwe kune yakakwira frequency application nekuda kwekugona kurasikirwa kwechiratidzo kunokonzerwa neiyo nickel barrier layer.

3. OSP (organic solderability preservative):
OSP inzira yekurapa pamusoro iyo inosanganisira kuisa organic layer yakatetepa yakananga pamusoro pemhangura kuburikidza nemakemikari reaction. OSP inopa inodhura-inoshanda uye ine hushamwari mhinduro sezvo isingade chero inorema simbi. Inopa nzvimbo yakatsetseka uye yakatsetseka inovimbisa yakanakisa solderability. Nekudaro, OSP machira anonzwira hunyoro uye anoda akakodzera mamiriro ekuchengetedza kuchengetedza kuvimbika kwavo. OSP-akarapwa mabhodhi zvakare anotapukirwa nekukwenya uye kubata kukuvadzwa kupfuura kumwe kurapwa kwepamusoro.

4. Sirivha yekunyudza:
Sirivha yekunyudza, inozivikanwawo sesirivha yekunyudza, isarudzo yakakurumbira yePCBs yakakwira nekuda kwekunaka kwayo uye kurasikirwa kwekuisa. Inopa nzvimbo yakati sandara, yakatsetseka inovimbisa kutendeseka solderability. Sirivha yekunyudza inonyanya kubatsira kune maPCB ane yakanaka-pitch zvikamu uye yakakwirira-kumhanya maapplication. Nekudaro, nzvimbo dzesirivheri dzinoita kushatisa munzvimbo dzine hunyoro uye dzinoda kubata kwakakodzera uye kuchengetedza kuchengetedza kuvimbika kwavo.

5. Kuiswa kwegoridhe rakaomarara:
Kuiswa kwegoridhe rakaomarara kunosanganisira kuisa mutsetse wakakora wegoridhe pamusoro pemhangura kuburikidza nenzira ye electroplating. Iyi kurapa kwepamusoro inovimbisa yakanakisa conductivity yemagetsi uye kusagadzikana kwekuora, zvichiita kuti ive yakakodzera kune maapplication anoda kudzokororwa kuiswa uye kubviswa kwezvikamu. Hard goridhe plating inowanzoshandiswa pamapendero ekubatanidza uye switch. Zvisinei, mari yekurapa iyi yakakwira zvakanyanya kana ichienzaniswa nemamwe marapirwo epamusoro.

Muchidimbu, Kusarudza iyo yakakwana yepamusoro pekupedzisira ye12-layer PCB yakakosha pakuita kwayo uye kuvimbika.Imwe neimwe nzira yekurapa pamusoro ine zvayakanakira uye zvinogumira, uye sarudzo inotsamira pane yako chaiyo application zvinodiwa uye bhajeti. Kunyangwe iwe ukasarudza inodhura-inoshanda yekupfapfaidza tin, yakavimbika kunyudza goridhe, zvakatipoteredza ishamwari OSP, yakakwirira-frequency kunyudzwa sirivha, kana yakaomarara goridhe plating, kunzwisisa mabhenefiti uye kufunga kwekurapwa kwega kwega kuchakubatsira kusimudzira PCB yako yekugadzira maitiro uye kuve nechokwadi chekubudirira yako Electronic midziyo.