Ndeapi maitiro akajairika ekutadza mabhodhi akaomarara-flex?

Rigid-flex circuit mabhodhi ane yakasarudzika dhizaini mabhenefiti, achibatanidza kugadzikana kwemabhodhi akaomeswa nekushanduka-shanduka kwemaseketi anochinjika. Iyi hybrid dhizaini inogonesa yakawanda compact uye inogoneka zvemagetsi, zvichiita kuti ive yakakodzera kune akasiyana maapplication anosanganisira aerospace, zvekurapa uye zvemagetsi zvevatengi. Nekudaro, senge chero chimwe chikamu chemagetsi, rigid-flex edunhu mabhodhi haana kudzivirirwa mukukundikana. Kunzwisisa kwakajairwa kutadza modes kunogona kubatsira mainjiniya kugadzira akasimba, akavimbika edunhu mabhodhi. Muchinyorwa chino, isu tichaongorora anowanzo kutadza mamodhi eakaomesesa-flex edunhu mabhodhi uye nekupa ruzivo rwekudzivirira kutadza uku.

1. Flexible circuit kuneta:

Imwe yemabhenefiti makuru eiyo rigid-flex mapaneru ndeye kuchinjika kwavo, iyo inovabvumira kukotama uye kuchinjika kune yakaoma maumbirwo. Nekudaro, kuramba uchikotama uye kukotama kunogona kukonzera kuneta kwedunhu kupera nekufamba kwenguva. Izvi zvinogona kukonzera kutsemuka kana kutsemuka mumateki emhangura, zvichikonzera maseketi akavhurika kana kupindirana kwepakati. Kuti udzivise kufenda kwedunhu kuneta, mainjiniya anofanirwa kufunga nezve bend radius uye huwandu hwemabhenji mabhenji ayo bhodhi achasangana nawo mukati mehupenyu hwesevhisi. Kusimbisa flex circuits nekuwedzera zvigadziriso zvekutsigira kana kuita dhizaini dhizaini inogona kubatsira zvakare kudzikisira kutadza kunoenderana nekuneta.

2. Layering:

Delamination inoreva kupatsanurwa kwezvikamu zvakasiyana mukati meiyo rigid-flex circuit board. Izvi zvinogona kuitika nekuda kwezvikonzero zvakasiyana-siyana, kusanganisira kusabatana kwakashata pakati pematanho, tembiricha bhasikoro, kana mechanical stress. Delamination inogona kukonzera magetsi mapfupi, kuvhura, kana kuderedzwa kwebhodhi kuvimbika. Kuti uderedze njodzi ye delamination, nzira dzakakodzera dzelamination dzinofanira kuteverwa panguva yekugadzira. Izvi zvinosanganisira kushandisa zvemhando yepamusoro zvekubatanidza zvinhu, kudzora lamination paramita, uye kuve nechokwadi chakakwana chekurapa nguva. Pamusoro pezvo, kugadzira stackups ine yakaenzana kugovera mhangura uye kudzivirira yakawandisa tembiricha shanduko inogona kubatsira kudzivirira delamination.

3. Thermomechanical stress:

Rigid-flex mabhodhi anowanzoona akakosha thermomechanical kusagadzikana panguva yehupenyu hwavo hwesevhisi. Kushushikana uku kunogona kukonzerwa nekuchinja kwekushisa, humidity, kana mechanical shock uye vibration. Thermo-mechanical stress inogona kukonzera kutsemuka kana solder joint kutadza, zvichikonzera nyaya dzekuvimbika kwemagetsi. Kuti uderedze kutadza kunoenderana nekushushikana kwe thermomechanical, mainjiniya anofanirwa kusarudza nekukodzera zvinhu zvine coefficient yakakodzera yekuwedzera kwekupisa (CTE) kune yega yega bhodhi rigid-flex board. Pamusoro pezvo, kushandisa nzira dzakakodzera dzekudziya dzekudziya, dzakadai sekushandisa singi yekupisa kana thermal vias, zvinogona kubatsira kubvisa kupisa uye kuderedza kushushikana pabhodhi redunhu.

4. Kusvibiswa uye ngura:

Kusvibiswa uye kuora ndiwo maitiro akajairika ekutadza mune chero mudziyo wemagetsi, uye akaomesesa-flex mabhodhi haana mutsauko. Kusvibiswa kunogona kuitika panguva yekugadzira kana nekuda kwezvakatipoteredza zvinhu zvakaita sehunyoro kana kuratidzwa kumakemikari. Kune rumwe rutivi, kuvapo kwehunyoro kana magasi anoparadza kunowanzoita kuti kuora. Zvose kusvibiswa uye kuora zvinogona kukonzera kuti mabhodhi edunhu aite pfupi kunze kana kuderedza kushanda. Kuti udzivise nzira idzi dzekutadza, matanho akasimba ekudzora emhando anofanirwa kuitwa panguva yekugadzira. Uye zvakare, conformal coatings kana encapsulation inogona kupa chinodzivirira kubva kune zvakatipoteredza zvinhu.

5. Connector uye solder joint kukundikana:

Zvibatanidza uye majoini ekutengesa ndiwo akakosha maficha mune rigid-flex redunhu mabhodhi. Kukundikana kwezvikamu izvi kunogona kukonzera kupindirana kwepakati, kuvhurika maseketi, kana kuderedzwa kwechiratidzo chekutendeseka. Zvinowanzo zvikonzero zvekubatanidza uye solder joint kutadza zvinosanganisira mechanical stress, tembiricha bhasikoro, kana nzira isina kufanira solder. Kuti ive nechokwadi chekuvimbika kwezvibatanidza uye majoini ekutengesa, mainjiniya anofanirwa kusarudza emhando yepamusoro zvikamu, kuve nechokwadi chekumisikidza uye kukwana, uye kutevedzera yakakurudzirwa solder nhungamiro senge tembiricha chaiyo, nguva, uye flux application.

Muchidimbu, nepo rigid-flex redunhu mabhodhi achipa akawanda mabhenefiti, anotarirwa kune chaiwo kutadza modes. Kunzwisisa aya akajairwa kutadza modes kwakakosha pakugadzira akavimbika uye akasimba maseketi. Nekufunga zvinhu zvakaita senge flex wedunhu kuneta, delamination, thermomechanical stress, kusvibiswa uye corrosion, pamwe nekubatanidza uye solder kutadza kwakabatana, mainjiniya anogona kuita akakodzera matanho ekudzivirira panguva yekugadzira, kugadzira uye kuyedza matanho. Nekutarisisa kwakakodzera kune aya mamodhi ekutadza, akaomesesa-flex edunhu mabhodhi anogona kupa hukuru hwekuita uye hupenyu hwesevhisi hurefu mumhando dzakasiyana dzekushandisa.