Ndeapi magadzirirwo ekufunga kweHDI Boards?

HDI (High Density Interconnect) mabhodhi ave sarudzo yekuenda kune yemazuva ano zvigadzirwa zvemagetsi. Ivo vanopa akawanda mabhenefiti pamusoro pechinyakare akadhindwa edunhu mabhodhi (PCBs), seyepamusoro wedunhu density, madiki fomu zvinhu, uye yakagadziridzwa chiratidzo chekuvimbika. Zvisinei,iyo yakasarudzika dhizaini yekutarisisa yeHDI mabhodhi inoda kunyatsoronga uye kuita kuti ive nechokwadi chekuita kwakanyanya uye kuvimbika. Pano tichaongorora zvinhu zvakakosha zvinofanirwa kutariswa pakugadzira HDI board.

1. Miniaturization uye chikamu dhizaini:

Chimwe chezvikonzero chikuru chekushandisa HDI mabhodhi kugona kwavo kugarisa nhamba yakakura yezvikamu mudiki tsoka. Semugadziri, iwe unofanirwa kufunga nezve miniaturization chimiro uye kunyatsoronga marongero ezvikamu. Kuiswa kwechikamu kunoita basa rakakosha mukuwana compact dhizaini pasina kukanganisa chiratidzo chekuvimbika.

Kuti ugone kukwirisa miniaturization, funga kushandisa zvidiki, zvakanyanya compact zvikamu. Uye zvakare, kushandiswa kwepamusoro Mount tekinoroji (SMT) inogonesa kunyatsoita chikamu chekuisa, kuderedza saizi yese yebhodhi. Nekudaro, ive shuwa yekuongorora kutariswa kwekupisa uye kuve nechokwadi chekutonhodza nzira dzakakwana, kunyanya kune yakakwirira simba zvikamu.

2. Chiratidzo chekuvimbika uye kutapurirana:

HDI mabhodhi anotsigira yakakwirira frequency uye yakanyanya kumhanya maapplication, saka kuvimbika kwechiratidzo kunova chinhu chakakosha kufunga. Kuderedza kurasikirwa kwechiratidzo uye kupindira kwakakosha kuitira kuchengetedza kutendeseka kwechiratidzo. Hezvino zvimwe zvakakosha zvekuchengeta mupfungwa:

a. Impedance Control:Inovimbisa kwakaringana impedance inoenderana mubhodhi. Izvi zvinogona kuwanikwa nekunyatso kusarudzwa kwekutevera hupamhi, spacing uye dielectric zvinhu. Kuomerera kune inodzorwa impedance miyero yakanangana nechikumbiro chako kwakakosha kuti uderedze kusaina chiratidzo.

b. Controlled crosstalk:Madhizaini akakwira-density anowanzo konzera kuomarara kwekutsvaga nzvimbo pamabhodhi eHDI, izvo zvinotungamira kune crosstalk. Crosstalk inoitika kana chiratidzo chikavhiringidza maronda ari padyo, zvichikonzera kudzikisira kwechiratidzo. Kudzikisira mhedzisiro yecrosstalk, shandisa matekiniki akadai sekusiyanisa pairing nzira, kudzivirira, uye kwakakodzera pasi ndege basa.

c. Simba Kuperera:Kuchengetedza kugadzika kwemagetsi kugovera mukati mebhodhi kwakakosha kune yakakwana yekufambiswa kwechiratidzo. Sanganisira yakakwana decoupling capacitors, ndege dzepasi, uye ndege dzemagetsi kuti ive nechokwadi yakaderera impedance nzira yekufambisa simba.

d. EMI/EMC Zvinotarisirwa:Sezvo kuwanda kwedunhu kunowedzera, ndizvo zvinoitawo njodzi yeElectromagnetic Interference (EMI) uye Electromagnetic Compatibility (EMC) nyaya. Teerera kune kwakaringana nzira dzekumisa pasi, nzira dzekudzivirira, uye EMI mafirita kuti uderedze kusawirirana kweiyo HDI bhodhi kune yekunze kukanganiswa kwemagetsi.

3. Kugadzira matambudziko uye kusarudzwa kwezvinhu:

Kugadzira uye kugadzira HDI mabhodhi anogona kupa matambudziko akasiyana nekuda kwekuwedzera kuoma. Kusarudza zvinhu zvakakodzera uye maitiro ekugadzira zvakakosha pakubudirira kwekugadzira. Funga zvinotevera:

a. Layer stack-up uye kuburikidza nekuronga:HDI mabhodhi anowanzo kuve neakawanda akaturikidzana, kazhinji mune yakaoma stack-ups. Nyatsoronga dhizaini-yepamusoro kuti igadzirise yaunoda density yenzira, uchifunga zvinhu zvakaita senge saizi yekuchera, kuburikidza nemhando (senge bofu, kuvigwa, kana microvia), nekuiswa kwayo. Yakakodzera kuburikidza nekuronga inova nechokwadi chekufambisa chiratidzo pasina kukanganisa kuvimbika.

b. Kusarudzwa kwezvinhu:Sarudza iyo yakakodzera laminate zvinhu zvichibva pane yaunoda mashandiro emagetsi, zvinodikanwa zvekutonga kwemafuta, uye kufunga kwemitengo. HDI mabhodhi anowanzo vimba nezvinhu zvine hunyanzvi zvine tembiricha yakakwira yegirazi, yakaderera dissipation zvinhu, uye yakanaka yekupisa yekupisa. Bvunza vatengesi vezvinhu kuti vaone sarudzo yakakodzera kwazvo.

c. Manufacturing Tolerances:Iyo miniaturization uye kuwedzera kuomarara kwemabhodhi eHDI kunoda kushivirira kwekugadzira. Iva nechokwadi chekutsanangura uye kutaurira kushivirira kwako kune mugadziri kuti uve nechokwadi chekugadzira uye kukwana.

4. Kuvimbika uye Kuyedzwa Mafungiro:

Kuvimbika kweHDI board kwakakosha kune yainoda kuita. Kuti uvandudze kuvimbika uye kurerutsa kugadzirisa matambudziko, funga zvinotevera magadzirirwo ekufunga:

a. Dhizaini yeKuedza (DFT):Kubatanidza mapoinzi ebvunzo, senge logic analyzer yekuwana mapoinzi kana muganhu-scan bvunzo mapoinzi, anogona kubatsira mumashure-kugadzira bvunzo uye kugadzirisa.

b. Thermal kufunga:Sezvo HDI mabhodhi anowanzo rongedza huwandu hukuru hwezvikamu munzvimbo diki, kudziya kwekutonga kunova kwakakosha. Shandisa nzira dzekutonhodza dzakafanira, dzakadai semadhishi ekupisa kana maburi ekupisa, kuona kuti zvinhu zvinoshanda mukati memiganhu yetembiricha yakatarwa.

c. Environmental Factors:Nzwisisa mamiriro ekunze ayo HDI board ichashanda uye kugadzira zvinoenderana. Zvinhu zvakadai sekushisa kwakanyanya, humidity, guruva, uye vibration zvinotariswa kuti ive nechokwadi chekuti bhodhi rinokwanisa kumira zvakaringana.

Muchidimbu, kugadzira bhodhi reHDI kunoda kutariswa kwezvinhu zvakati wandei kuti uwane yakakwirira redunhu density, optimize chiratidzo chekuvimbika, kuve nechokwadi chekuvimbika, uye kurerutsa kugadzira. Nekunyatsoronga uye nekuita miniaturization zano, uchifunga kutendeseka kwechiratidzo uye misimboti yekufambisa, kusarudza zvinhu zvakakodzera, uye kugadzirisa nyaya dzekuvimbika, unogona kuona kugona kwakazara kweHDI tekinoroji mumagadzirirwo ako.Shenzhen Capel Technology Co., Ltd. yave ichibatanidzwa zvakanyanya mumabhodhi edunhu kwemakore gumi nemashanu. Nekuyerera kwakasimba kwemaitiro, kugona kwepamberi, hunyanzvi hwehunyanzvi masevhisi, ruzivo rwakapfuma rweprojekiti uye tekinoroji yehunyanzvi, takunda kuvimba nevatengi. Uye pese patinogona kuwana mukana wemusika weprojekiti yemutengi.