Chii chinonzi Rigid Flex PCB Stackup

Munyika yanhasi inomhanya-mhanya yetekinoroji, midziyo yemagetsi iri kuramba ichiwedzera uye diki. Kuzadzisa zvinodikanwa zvezvishandiso zvemazuva ano izvi, mabhodhi edunhu akadhindwa (PCBs) anoenderera mberi nekuchinja uye nekubatanidza maitiro matsva ekugadzira. Imwe tekinoroji yakadaro yakasimba flex pcb stackup, iyo inopa zvakawanda zvakanakira maererano nekuchinjika uye kuvimbika.Iri gwara rakazara rinoongorora kuti rigid-flex redunhu bhodhi stackup chii, mabhenefiti ayo, uye kuvaka kwayo.

Tisati tanyura mune izvo, ngatitangei tiende pamusoro peiyo yekutanga PCB stackup:

PCB stackup inoreva kurongeka kweakasiyana edunhu bhodhi akaturikidzana mukati mePCB imwechete. Inosanganisira kubatanidza zvinhu zvakasiyana-siyana kugadzira mapuranga akawanda anopa magetsi ekubatanidza. Sechinyakare, neyakaomesesa PCB stackup, zvinhu zvakaomarara chete zvinoshandiswa kubhodhi rese. Nekudaro, nekuunzwa kwezvinhu zvinochinjika, pfungwa nyowani yakabuda-yakasimba-yakaomarara PCB stackup.

Saka, chii chaizvo chinonzi rigid-flex laminate?

Yakaomarara-inochinjika PCB stackup ndeye hybrid yedunhu bhodhi rinosanganisa yakaoma uye inochinjika PCB zvinhu. Iyo inoumbwa nealternating akaomesesa uye anochinjika akaturikidzana, achibvumira bhodhi kukotama kana kuchinjika sezvinodiwa uku ichichengetedza kutendeseka kwayo uye kushanda kwemagetsi. Iyi yakasarudzika musanganiswa inoita yakaomesesa-inochinjika PCB stackups yakanakira maapplication uko nzvimbo yakakosha uye ine simba kukotama inodiwa, senge zvinopfekwa, midziyo yemuchadenga, uye michina yekurapa.

Zvino, ngationgororei mabhenefiti ekusarudza yakaomesesa-flex PCB stackup yemagetsi ako.

Kutanga, kushanduka kwayo kunobvumira bhodhi kuti ikwane munzvimbo dzakasimba uye ienderane nemaitiro asina kujairika, kuwedzera nzvimbo iripo. Uku kuchinjika zvakare kunoderedza huwandu hwese uye huremu hwechishandiso nekubvisa kudiwa kwezvibatanidza uye kuwedzera wiring. Pamusoro pezvo, kusavapo kwezvibatanidza kunoderedza zvingangoitika zvekutadza, kuwedzera kuvimbika. Pamusoro pezvo, kudzikiswa kwewaya kunovandudza kutendeseka kwechiratidzo uye kunoderedza nyaya dzemagetsi (EMI) nyaya.

Kuvakwa kweyakaomesesa-flex PCB stackup inosanganisira akati wandei akakosha zvinhu:

Iyo inowanzo sanganisira akawanda akaomeswa akaturikidzana akabatana neanochinjika maseru. Nhamba yezvikamu zvinoenderana nekuoma kwekugadzirwa kwedunhu uye basa rinodiwa. Matunhu akaomarara anowanzo kuve akajairwa FR-4 kana akakwira-tembiricha laminates, nepo anochinjika maseru ari polyimide kana akafanana anochinjika zvinhu. Kuve nechokwadi chekubatana kwemagetsi pakati peakaomarara uye anochinjika akaturikidzana, yakasarudzika mhando yekunamira inonzi anisotropic conductive adhesive (ACA) inoshandiswa. Ichi chinonamira chinopa zvese zvemagetsi uye zvemagetsi zvinongedzo, kuve nechokwadi chekuita kwakavimbika.

Kuti unzwisise chimiro cheakaomesesa-flex PCB stack kumusoro, heino kuparara kweiyo 4-layer rigid-flex PCB board chimiro:

Top layer:
Green solder mask ndeye inodzivirira yakaiswa paPCB (Yakadhindwa Circuit Board)
Layer 1 (Signal Layer):
Base Copper layer ine Plated Copper traces.
Layer 2 (Inner Layer/dielectric layer):
FR4: Ichi chinhu chakajairwa insulating zvinhu chinoshandiswa muPCB, chinopa tsigiro yemuchina uye kuparadzaniswa kwemagetsi.
Layer 3 (Flex Layer):
PP: Polypropylene (PP) adhesive layer inogona kupa dziviriro kune redunhu bhodhi
Layer 4 (Flex Layer):
Cover layer PI: Polyimide (PI) chinhu chinochinjika uye chinodzivirira kupisa chinoshandiswa sechidziviriro chepamusoro muchikamu chinochinjika chePCB.
Chivharo chedhishi AD: inopa dziviriro kune iri pasi pezvinhu kubva mukukuvadzwa nenharaunda yekunze, makemikari kana mavanga emuviri.
Layer 5 (Flex Layer):
Base Copper layer: Imwe nhanga yemhangura, inowanzo shandiswa pachiratidzo chechiratidzo kana kugovera simba.
Layer 6 (Flex Layer):
PI: Polyimide (PI) chinhu chinochinjika uye chinodzivirira kupisa chinoshandiswa sechigadziko muchikamu chinochinjika chePCB.
Layer 7 (Flex Layer):
Base Copper layer: Imwezve danga remhangura, rinowanzo shandiswa sechiratidzo chechiratidzo kana kugovera simba.
Layer 8 (Flex Layer):
PP: Polypropylene (PP) chinhu chinochinjika chinoshandiswa muchikamu chinochinjika chePCB.
Cowerlayer AD: inopa dziviriro kuzvinhu zviri pasi kubva pakukuvadzwa nenharaunda yekunze, makemikari kana mavanga emuviri.
Cover layer PI: Polyimide (PI) chinhu chinochinjika uye chinodzivirira kupisa chinoshandiswa sechidziviriro chepamusoro muchikamu chinochinjika chePCB.
Layer 9 (Inner Layer):
FR4: Imwe dhizaini yeFR4 inosanganisirwa yekuwedzera mekiniki rutsigiro uye kuparadzaniswa kwemagetsi.
Layer 10 (Pazasi Layer):
Base Copper layer ine Plated Copper traces.
Pazasi layer:
Green soldermask.

Ndokumbira utarise kuti kune yakanyatso ongororo uye chaiyo dhizaini kufunga, zvinokurudzirwa kubvunza mugadziri wePCB kana mugadziri anogona kupa ongororo yakadzama uye kurudziro zvichienderana nezvako chaizvo zvaunoda uye zvipingaidzo.

Muchidimbu:

Rigid flex PCB stackup imhinduro yekuvandudza inosanganisa mabhenefiti ezvakaomarara uye anochinjika PCB zvinhu. Kuchinjika kwayo, kusimba uye kuvimbika kunoita kuti ive yakakodzera kune akasiyana maapplication anoda nzvimbo optimization uye ine simba kukotama. Kunzwisisa izvo zvekutanga zveakaomesesa-flex stackups uye kuvaka kwavo kunogona kukubatsira iwe kuita sarudzo dzine ruzivo paunenge uchigadzira uye kugadzira zvigadzirwa zvemagetsi. Sezvo tekinoroji ichiramba ichifambira mberi, kudiwa kweiyo rigid-flex PCB stackup pasina mubvunzo kuchawedzera, kufambisa imwe budiriro mundima iyi.