CAPEL FPC & Flex-Rigid PCB Kugadzira Kugona
| Product | High Density | |||
| Interconnect (HDI) | ||||
| Standard Flex circuits Flex | Flat Flexible Circuits | Rigid Flex Circuit | Membrane Swichi | |
| Standard Panel Size | 250mm X 400mm | Roll fomati | 250mmX400mm | 250mmX400mm |
| mutsetse upamhi uye Spacing | 0.035mm 0.035mm | 0 .010"(0.24mm) | 0.003"(0.076mm) | 0.10"(.254mm) |
| Copper Kukora | 9um/12um/18um/35um/70um/100um/140um | 0.028mm-.01mm | 1/2 oz.uye kumusoro | 0.005"-.0010" |
| Layer Count | 1-32 | 1-2 | 2-32 | 1-2 |
| VIA / DILL SIZE | ||||
| Minimum Drill ( Mechanical) Hole Diameter | 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) | N/A | 0.006" ( 0.15 mm) | 10 mirimita (0.25 mm) |
| Minimum Via ( Laser) Size | 4 mirimita (0.1mm) 1 mirimita (0.025 mm) | N/A | 6 mirimita ( 0.15 mm) | N/A |
| Minimum Micro Via ( Laser) Size | 3 mil (0.076 mm) 1 mirimita ( 0.025 mm) | N/A | 3 mirimita ( 0.076 mm) | N/A |
| Stiffener Material | Polyimide / FR4 / Metal / SUS / Alu | PET | FR-4 / Poyimide | PET / Metal/FR-4 |
| Shielding Material | Mhangura / sirivha Lnk / Tatsuta / Carbon | Silver Foil/Tatsuta | Mhangura / Silver Ink/Tadduta / Carbon | Silver Foil |
| Tooling Material | 2 mirimita ( 0.051 mm) 2 mirimita ( 0.051 mm) | 10 mirimita (0.25mm) | 2 mirimita (0.51 mm) | 5 mirimita ( 0.13 mm) |
| Zif Kushivirira | 2 mirimita ( .051 mm) 1 mirimita ( 0.025 mm) | 10 mirimita (0.25mm) | 2 mirimita (0.51 mm) | 5 mirimita ( 0.13 mm) |
| SOLDER MASK | ||||
| Solder Mask Bridge Pakati peDamu | 5 mil ( .013 mm) 4 mi. | N/A | 5 mirimita ( 0.13 mm) | 10 mirimita (0.25mm) |
| Solder Mask Registration Tolerance | 4 mil ( .010 mm) 4 mirimita( 0.01mm) | N/A | 5 mirimita ( 0.13 mm) | 5 mirimita ( 0.13 mm) |
| KAVIRI | ||||
| Coverlay Registration | 8 miriyoni 5 miriyoni | 10 miriyoni | 8 miriyoni | 10 miriyoni |
| PIC Kunyoresa | 7 miriyoni 4 miriyoni | N/A | 7 miriyoni | N/A |
| Solder Mask Registration | 5 miriyoni 4 miriyoni | N/A | 5 miriyoni | 5 miriyoni |
| Surface Finish | ENIG/Kunyudza Sirivha/Kunyudza Tin/Goridhe Plating/Tin Plating/OSP/ ENEPIG | |||
| Legend | ||||
| Minimum Height | 35 miriyoni 25 miriyoni | 35 miriyoni | 35 miriyoni | Graphic Overlay |
| Minimun width | 8 miriyoni 6 | 8 miriyoni | 8 miriyoni | |
| Minimum Space | 8 miriyoni 6 | 8 miriyoni | 8 miriyoni | |
| Kunyoresa | ±5mil ±5mil | ±5mil | ±5mil | |
| Impedance | ±10% ±10% | ±20% | ±10% | NA |
| SRD ( Steel Rule Die ) | ||||
| Rondedzera Kushivirira | 5 mil ( 0.13 mm) 2 miriyoni ( 0.051 mm) | N/A | 5 mirimita ( 0.13 mm) | 5 mirimita ( 0.13 mm) |
| Minimum radius | 5 mirimita (0.13 mm) 4 mirimita (0.10 mm) | N/A | 5 mirimita ( 0.13 mm) | 5 mirimita ( 0.13 mm) |
| Mukati meRadhiyasi | 20 mirimita (0.51 mm) 10 mirimita (0.25 mm) | N/A | 31 miriyoni | 20 mirimita (0.51 mm) |
| Punch Minimum Hole Saizi | 40 mirimita ( 10.2 mm) 31.5 miriyoni ( 0.80 mm) | N/A | N/A | 40 mirimita (1.02 mm) |
| Kushivirira kwePunch Hole Saizi | ± 2mil ( 0.051 mm) ± 1 mil | N/A | N/A | ± 2 mil ( 0.051 mm) |
| Slot Width | 20 mirimita (0.51 mm) 15 mirimita (0.38 mm) | N/A | 31 miriyoni | 20 mirimita (0.51 mm) |
| Toleranc yegomba kurondedzera | ± 3 miriyoni ± 2 miriyoni | N/A | ±4 miriyoni | 10 miriyoni |
| Kushivirira kwegomba kumucheto kurondedzera | ± 4 mil ± 3 miriyoni | N/A | ±5 miriyoni | 10 miriyoni |
| Zvishoma zveTrace kutsanangura | 8 miriyoni 5mil | N/A | 10 miriyoni | 10 miriyoni |
CAPEL PCB Kugadzira Kugona
| Technical Parameters | ||
| Aihwa. | Project | Technical zviratidzo |
| 1 | Layer | 1-60 (mutsetse) |
| 2 | Maximum processing area | 545 x 622 mm |
| 3 | Minimumboard thickness | 4(layer)0.40mm |
| 6(layer) 0.60mm | ||
| 8(mutsetse) 0.8mm | ||
| 10(layer)1.0mm | ||
| 4 | Minimum line width | 0.0762mm |
| 5 | Minimum spacing | 0.0762mm |
| 6 | Minimum mechanical aperture | 0.15mm |
| 7 | Gomba rusvingo rwemhangura ukobvu | 0.015mm |
| 8 | Metallized aperture tolerance | ± 0.05mm |
| 9 | Non-metallized aperture kushivirira | ± 0.025mm |
| 10 | Gomba kushivirira | ± 0.05mm |
| 11 | Dimensional kushivirira | ± 0.076mm |
| 12 | Minimum solder zambuko | 0.08mm |
| 13 | Insulation resistance | 1E+12Ω (yakajairika) |
| 14 | Plate ukobvu ratio | 1:10 |
| 15 | Thermal shock | 288 ℃ (4 nguva mumasekonzi gumi) |
| 16 | Yakakanganiswa uye yakakotama | ≤0.7% |
| 17 | Anti-magetsi simba | ＞1.3KV/mm |
| 18 | Anti-kubvisa simba | 1.4N/mm |
| 19 | Solder ramba kuoma | ≥6H |
| 20 | Flame retadancy | 94V-0 |
| 21 | Impedance control | ±5% |
CAPEL PCBA Kugadzira Kugona
| Category | Details | |
| Nguva Yekutungamira | Maawa makumi maviri nemana Prototyping, nguva yekuendesa yediki-batch inenge mazuva mashanu. | |
| PCBA Kukwanisa | SMT chigamba 2 miriyoni mapoinzi/zuva, THT 300,000 mapoinzi/zuva, 30-80 maodha / zuva. | |
| Components Service | Turnkey | Iine yakakura uye inoshanda chikamu chekutenga manejimendi system, isu tinoshandira PCBA mapurojekiti ane yakanyanya-mutengo wekuita. Chikwata chevanyanzvi vekutenga mainjiniya uye vane ruzivo rwekutenga vashandi vane basa rekutenga uye manejimendi ezvikamu zvevatengi vedu. |
| Kitted kana kutumirwa | Iine timu yakasimba yekutenga manejimendi uye chikamu chekutengesa cheni, Vatengi vanotipa zvinhu, tinoita basa regungano. | |
| Combo | Bvuma zvikamu kana zvikamu zvakakosha zvinopihwa nevatengi. uye zvakare zvikamu zvekushandisa kune vatengi. | |
| PCBA Solder Type | SMT, THT, kana PCBA soldering masevhisi ese ari maviri. | |
| Solder Paste/Tin Wire/Tin Bar | tungamira uye inotungamira-isina (RoHS inoenderana) PCBA yekugadzirisa masevhisi. Uye ipawo customized solder paste. | |
| Stencil | Laser yekucheka stencil kuve nechokwadi chekuti zvikamu zvakaita sediki-pitch ICs uye BGA kusangana neIPC-2 Kirasi kana yepamusoro. | |
| MOQ | 1 chidimbu, asi isu tinopa zano vatengi vedu kuti vagadzire angangoita mashanu masampuli ekuongorora kwavo uye kuyedzwa. | |
| Chikamu Saizi | • Passive components: isu takanaka pakukodzera iyo inch 01005 (0.4mm * 0.2mm), 0201 madiki madiki akadaro. | |
| • High-precision ICs dzakadai seBGA: Tinogona kuona BGA zvikamu ne Min 0.25mm spacing by X-ray. | ||
| Component Package | reel, tepi yekucheka, tubing, uye mapallets ezvikamu zveSMT. | |
| Maximum Mount Kurongeka kweZvikamu (100FP) | Kururama kuri 0.0375mm. | |
| Solderable PCB Type | PCB (FR-4, simbi substrate), FPC, Rigid-flex PCB, Aluminium PCB, HDI PCB. | |
| Layer | 1－30(layer) | |
| Maximum processing area | 545 x 622 mm | |
| Minimumboard thickness | 4(layer)0.40mm | |
| 6(layer) 0.60mm | ||
| 8(mutsetse) 0.8mm | ||
| 10(layer)1.0mm | ||
| Minimum line width | 0.0762mm | |
| Minimum spacing | 0.0762mm | |
| Minimum mechanical aperture | 0.15mm | |
| Gomba rusvingo rwemhangura ukobvu | 0.015mm | |
| Metallized aperture tolerance | ± 0.05mm | |
| Non-metallized aperture | ± 0.025mm | |
| Gomba kushivirira | ± 0.05mm | |
| Dimensional kushivirira | ± 0.076mm | |
| Minimum solder zambuko | 0.08mm | |
| Insulation resistance | 1E+12Ω (yakajairika) | |
| Plate ukobvu ratio | 1:10 | |
| Thermal shock | 288 ℃ (4 nguva mumasekonzi gumi) | |
| Yakakanganiswa uye yakakotama | ≤0.7% | |
| Anti-magetsi simba | ＞1.3KV/mm | |
| Anti-kubvisa simba | 1.4N/mm | |
| Solder ramba kuoma | ≥6H | |
| Flame retadancy | 94V-0 | |
| Impedance control | ±5% | |
| File Format | BOM, PCB Gerber, Sarudza uye Nzvimbo. | |
| Testing | Tisati tasununguka, isu tichashandisa nzira dzakasiyana dzekuedza kuPCBA mugomo kana kutokwira kare: | |
| • IQC: kuongorora kunouya; | ||
| • IPQC: in-production inspection, LCR test for the first piece; | ||
| • Visual QC: routine quality check; | ||
| • AOI: soldering effect ye patch components, zviduku kana polarity yezvikamu; | ||
| • X-Ray: tarisa BGA, QFN uye imwe yakakwirira yakarurama yakavanzwa PAD zvikamu; | ||
| • Functional Testing: Basa rekuedza uye kushanda maererano nemaitiro ekuedzwa kwevatengi uye maitiro ekuona kutevedza. | ||
| Kugadzirisa & Rework | Yedu BGA Kugadzirisa Sevhisi inogona kubvisa zvakachengeteka yakarasika, kure-chinzvimbo, uye yekunyepedzera BGA uye kuibatanidza kuPCB zvakakwana. | |
