Muenzaniso: FR4 Yakadhindwa Circuit Boards
Chigadzirwa application: Smartphone
Board Layers: Multilayer
Base zvinhu: Polyimide(PI)
Mukati Cu ukobvu: 18um
Quter Cu ukobvu: 35um
Kavha yefirimu ruvara: Yero
Solder mask ruvara: Yero
Silkscreen: White
Kurapa kwepamusoro: ENIG
FPC ukobvu: 0.26 +/-0.03mm
Stiffener mhando: FR4, PI
Min Mutsetse upamhi / nzvimbo: 0.1/0.1mm
Min gomba: 0.15mm
Blind buri:/
Gomba rakavigwa:/
Gomba kushivirira(nm): PTH: 士 zvinhu: 士0.05
lBoard Layers:/
