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Multilayer PCBs Prototyping Manufacturers Quick Turn Pcb Boards

Tsanangudzo Pfupi

Chigadzirwa application: Automotive

Board Layers: 16 layer

Nheyo yezvinhu: FR4

Mukati Cu ukobvu: 18

Kunze Cu ukobvu: 35um

Solder mask ruvara: Green

Silkscreen ruvara: Ichena

Kurapa kwepamusoro: LF HASL

PCB ukobvu: 2.0mm +/-10%

Min Mutsetse upamhi / nzvimbo: 0.2/0.15m

Min gomba: 0.35mm

Bofu gomba: Hongu

Gomba rakavigwa: Hongu

Kushivirira kwegomba(nu): PTH: 土0.076, NTPH: 0.05

Inpedance:/


Product Detail

Product Tags

PCB Process Kugona

Aihwa. Project Technical zviratidzo
1 Layer 1-60 (mutsetse)
2 Maximum processing area 545 x 622 mm
3 Minimumboard thickness 4(layer)0.40mm
6(layer) 0.60mm
8(mutsetse) 0.8mm
10(layer)1.0mm
4 Minimum line width 0.0762mm
5 Minimum spacing 0.0762mm
6 Minimum mechanical aperture 0.15mm
7 Gomba rusvingo rwemhangura ukobvu 0.015mm
8 Metallized aperture tolerance ± 0.05mm
9 Non-metallized aperture kushivirira ± 0.025mm
10 Gomba kushivirira ± 0.05mm
11 Dimensional kushivirira ± 0.076mm
12 Minimum solder zambuko 0.08mm
13 Insulation resistance 1E+12Ω (yakajairika)
14 Plate ukobvu ratio 1:10
15 Thermal shock 288 ℃ (4 nguva mumasekonzi gumi)
16 Yakakanganiswa uye yakakotama ≤0.7%
17 Anti-magetsi simba >1.3KV/mm
18 Anti-kubvisa simba 1.4N/mm
19 Solder ramba kuoma ≥6H
20 Flame retadancy 94V-0
21 Impedance control ±5%

Isu tinoita Multilayer PCBs prototyping ine makore gumi nemashanu ruzivo nehunyanzvi hwedu

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4 layer Flex-Rigid Boards

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8 layer Rigid-Flex PCBs

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8 layer HDI PCBs

Kuedza uye Kuongorora Equipment

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Microscope Testing

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Kuongorora kweAOI

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2D Testing

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Impedance Testing

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RoHS Testing

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Flying Probe

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Horizontal Tester

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Bending Teste

Yedu Multilayer PCBs prototyping Service

. Ipa rubatsiro rwehunyanzvi Pre-kutengesa uye mushure-kutengesa;
. Tsika anosvika makumi mana akaturikidzana, 1-2days Kurumidza kutendeuka yakavimbika prototyping, Component procurement, SMT Assembly;
. Inobata kune ese ari maviri Medical Device, Industrial Control, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications etc..
. Zvikwata zvedu zvemainjiniya nevatsvaguri vakazvipira kuzadzisa zvaunoda nehungwaru uye nehunyanzvi.

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Multilayer PCB inopa yepamberi tekinoroji rutsigiro mumunda wemotokari

1. Car varaidzo system: multi-layer PCB inogona kutsigira mamwe maodhiyo, vhidhiyo uye isina waya yekutaurirana mabasa, nekudaro ichipa yakapfuma yemota varaidzo ruzivo. Inogona kugarisa mamwe maseketi edunhu, kusangana neakasiyana odhiyo uye mavhidhiyo ekugadzirisa zvinodiwa, uye inotsigira yakakwirira-kumhanya kutapurirana uye isina waya yekubatanidza mabasa, akadai seBluetooth, Wi-Fi, GPS, nezvimwe.

2. Chengetedzo system: yakawanda-layer PCB inogona kupa yakakwira kuchengetedzwa kwekuita uye kuvimbika, uye inoshandiswa kune mota inoshanda uye passive kuchengetedza masisitimu. Inogona kubatanidza masensa akasiyana-siyana, mayuniti ekudzora uye mamodule ekutaurirana kuti aone mabasa akadai seyambiro yekudhumhana, otomatiki braking, kutyaira zvine hungwaru, uye anti-kuba. Dhizaini yeakawanda-layer PCB inovimbisa kukurumidza, kwakaringana uye kwakavimbika kutaurirana uye kurongeka pakati peakasiyana ekuchengetedza system module.

3. Driving rubatsiro hurongwa: multi-layer PCB anogona kupa mukuru-chaizvo chiratidzo kugadzirisa uye kutsanya Data hutachiwana nokuda kutyaira rubatsiro hurongwa, akadai otomatiki kupaka, bofu gwapa kuona, adaptive rwendo kuzvidzora uye mukoto kuchengeta rubatsiro hurongwa, etc.
Aya masisitimu anoda chaiyo masaini kugadzirisa uye nekukurumidza kutumira data. Uye panguva yekuona uye kugona kutonga, uye tekinoroji rutsigiro rweakawanda-layer PCB inogona kusangana nezvinodiwa izvi.

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4. Injini manejimendi sisitimu: Iyo injini manejimendi system inogona kushandisa akawanda-layer PCB kuona chaiyo kutonga uye kutarisa kweinjini.
Inogona kubatanidza masensa akasiyana-siyana, ma actuators uye mayuniti ekudzora kuti atarise uye agadzirise maparameter akadai semafuta ekupa, nguva yekubatidza uye emission control yeinjini kuvandudza kushanda kwemafuta uye kuderedza kupera simba.

5. Electric drive system: multi-layer PCB inopa rubatsiro rwepamusoro rwehutano hwemagetsi ekugadzirisa simba uye kutumirwa kwemagetsi emagetsi emagetsi uye motokari dzemasanganiswa. Inogona kutsigira simba-simba rekufambisa uye oscillation control, kuvandudza kushanda uye kuvimbika kwebhatiri manejimendi system, uye nekuona basa rakarongeka remamodule akasiyana mumagetsi drive system.

Multilayer redunhu mabhodhi mumunda wemotokari FAQ

1. Kukura uye uremu: Nzvimbo mumotokari ishoma, saka ukuru uye uremu hwemultilayer circuit board ndizvowo zvinhu zvinoda kutariswa. Mabhodhi akakurisa kana kurema anogona kudzikamisa dhizaini nekushanda kwemotokari, saka pane kudikanwa kwekudzikisa bhodhi saizi uye huremu mukugadzira uchichengetedza kushanda uye kuita zvinodiwa.

2. Anti-vibration uye kukanganisa kupikisa: Mota ichaiswa kune zvakasiyana-siyana zvekuzununguka uye zvinokanganisa panguva yekutyaira, saka multilayer circuit board inoda kuva ne-anti-vibration yakanaka uye kukanganisa kwemaitiro. Izvi zvinoda kurongeka kunonzwisisika kwechimiro chinotsigira chebhodhi redunhu uye kusarudzwa kwezvinhu zvakakodzera kuti ive nechokwadi chekuti bhodhi redunhu rinogona kuramba richishanda zvakatsiga pasi pemamiriro akaomarara emugwagwa.

3. Kuchinjika kwezvakatipoteredza: Nzvimbo yekushanda yemotokari yakaoma uye inoshanduka, uye mabhodhi ematunhu akawanda-akawanda anofanira kukwanisa kuenderana nemamiriro akasiyana-siyana ezvakatipoteredza, zvakadai sekushisa kwepamusoro, kupisa kwakadzika, humidity, nezvimwewo. sarudza zvinhu zvine kunaka kwepamusoro tembiricha kuramba, kushoma tembiricha kuramba uye hunyoro kuramba, uye Tora anoenderana ekudzivirira matanho ekuona kuti redunhu bhodhi rinogona kushanda zvakavimbika munzvimbo dzakasiyana siyana.

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4. Kuenderana uye dhizaini dhizaini: Multilayer redunhu mabhodhi anofanirwa kuenderana uye akabatana nemamwe magadzirirwo emagetsi uye masisitimu, saka inowirirana dhizaini dhizaini uye bvunzo yekutarisa inodiwa. Izvi zvinosanganisira kusarudzwa kwezvibatanidza, kutevedzera maitiro ehuratidziro, uye kuvimbiswa kweiyo interface chiratidzo kugadzikana uye kuvimbika.

6. Chip packaging uye programming: chip packaging uye purogiramu inogona kubatanidzwa mumapuraneti ematunhu akawanda. Paunenge uchigadzira, zvinodikanwa kufunga nezvepakeji fomu uye saizi yechip, pamwe neiyo interface uye nzira yekupisa uye kuronga. Izvi zvinovimbisa kuti chip ichave yakarongedzwa uye inomhanya nemazvo uye nekuvimbika.


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