Single-Layer Fr4 PCB Board Quick Turn Pcb Fabrication
PCB Process Kugona
| Aihwa. | Project | Technical zviratidzo |
| 1 | Layer | 1-60 (mutsetse) |
| 2 | Maximum processing area | 545 x 622 mm |
| 3 | Minimumboard thickness | 4(layer)0.40mm |
| 6(layer) 0.60mm | ||
| 8(mutsetse) 0.8mm | ||
| 10(layer)1.0mm | ||
| 4 | Minimum line width | 0.0762mm |
| 5 | Minimum spacing | 0.0762mm |
| 6 | Minimum mechanical aperture | 0.15mm |
| 7 | Gomba rusvingo rwemhangura ukobvu | 0.015mm |
| 8 | Metallized aperture tolerance | ± 0.05mm |
| 9 | Non-metallized aperture kushivirira | ± 0.025mm |
| 10 | Gomba kushivirira | ± 0.05mm |
| 11 | Dimensional kushivirira | ± 0.076mm |
| 12 | Minimum solder zambuko | 0.08mm |
| 13 | Insulation resistance | 1E+12Ω (yakajairika) |
| 14 | Plate ukobvu ratio | 1:10 |
| 15 | Thermal shock | 288 ℃ (4 nguva mumasekonzi gumi) |
| 16 | Yakakanganiswa uye yakakotama | ≤0.7% |
| 17 | Anti-magetsi simba | ＞1.3KV/mm |
| 18 | Anti-kubvisa simba | 1.4N/mm |
| 19 | Solder ramba kuoma | ≥6H |
| 20 | Flame retadancy | 94V-0 |
| 21 | Impedance control | ±5% |
Isu tinoita HDI Circuit Board ine makore gumi nemashanu ruzivo nehunyanzvi hwedu
4 layer Flex-Rigid Boards
8 layer Rigid-Flex PCBs
8 layer HDI PCBs
Kuedza uye Kuongorora Equipment
Microscope Testing
Kuongorora kweAOI
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Yedu HDI Circuit Board Service
.Ipa rubatsiro rwehunyanzvi Pre-kutengesa uye mushure-kutengesa;
.Tsika anosvika makumi mana akaturikidzana, 1-2days Kurumidza kutendeuka yakavimbika prototyping, Component procurement, SMT Assembly;
.Inobata kune ese ari maviri Medical Device, Industrial Control, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications etc..
.Zvikwata zvedu zvemainjiniya nevatsvaguri vakazvipira kuzadzisa zvaunoda nehungwaru uye nehunyanzvi.
Single-layer fr4 PCB Board inoshandiswa muUAV
1. Saizi uye dhizaini optimization: Sezvo imwe-layer FR4 PCB ichipa nzvimbo shoma yezvikamu uye maronda, saizi uye marongero ebhodhi anofanira kuvandudzwa kuti agone kugarisa zvese zvinodiwa zvikamu uye zviteshi.Izvi zvinogona kuda kungwarira kwechikamu chekuisa uye nzira yehungwaru kuderedza kukanganiswa kwechiratidzo uye kuwedzera kushanda zvakanaka.
2. Simba rekugovera uye mutemo wemagetsi: Kugoverwa kwemagetsi kunonzwisisika uye kutonga kwemagetsi ndicho chinhu chinokosha chekushanda kwakagadzikana uye kwakavimbika kweUAVs.Iyo imwechete-layer FR4 PCB inofanirwa kugadzirwa kuti iise magetsi edunhu, anosanganisira voltage regulators, mafirita, uye decoupling capacitors, kuve nechokwadi chesimba rinoenderana kune zvese zvikamu.
3. Zviratidzo zvekuvimbika kwechiratidzo: UAVs inowanzoda kutaurirana kwakarurama uye kutonga, saka kutendeseka kwechiratidzo kunokosha.
Single-layer FR4 PCBs inogona kuve nyore kutapurira kukanganiswa uye ruzha kupfuura akawanda-layer board.Dhizaini yekufunga senge trace impedance control, yakakodzera dhizaini dhizaini, uye kurongeka kwemasekete anonzwisa tsitsi kunofanirwa kutariswa kuchengetedza chiratidzo chekuvimbika.
4. Kuiswa kwechikamu uye kusagadzikana kwekudengenyeka: maUAV achave ari pasi pekudengenyeka uye kushamiswa panguva yekushanda, saka kupesana kwekudengenyeka kunofanira kufungwa kana kuisa zvikamu pane imwe-layer FR4 PCB.Kuisa zvinhu zvakachengeteka, kushandisa vibration-damping materials, uye kushandisa nzira dzakakodzera dzekutengesa kwakakosha kuitira kuti PCB irarame kwenguva refu uye kuvimbika.
5. Thermal management: MaUAV anowanzo gadzira kupisa nekuda kwemota, zvikamu zvemagetsi, uye magetsi.Kubudirira kwekutonga kwemafuta kunodiwa kudzivirira kupisa uye kutadza kwechikamu.Paunenge uchigadzira imwe-layer FR4 PCB, kutariswa kunofanirwa kupihwa kubvumira nzvimbo yakakwana yekupisa sinks, thermal vias, uye kuyerera kwemhepo kwakakodzera kwekubvisa kupisa kunoshanda.
6. Mafungiro ezvakatipoteredza: Drones inogona kushanda munzvimbo dzakasiyana-siyana dzezvakatipoteredza, kusanganisira hunyoro hwepamusoro, kuchinja kwekushisa, uye kutarisana neguruva uye unyoro.Single-layer FR4 PCBs inofanirwa kugadzirwa neyakakodzera conformal coating kana encapsulation kudzivirira kubva kune zvakatipoteredza zvinhu uye kuve nechokwadi chekuvimbika kwenguva refu.
Single-layer fr4 PCB Board FAQ
1. Chii chinonzi FR4 PCB?
FR4 inoreva murazvo unodzoreredza fiberglass epoxy laminate inoshandiswa muPCB (yakadhindwa redunhu bhodhi) kugadzira.
FR4 PCB inoshandiswa zvakanyanya kune yayo yakanakisa magetsi ekudzivirira, simba remagetsi uye kudzoreredza kwemurazvo.
2. Chii chinonzi single-layer FR4 PCB?
Iyo imwe chete layer FR4 PCB ndeye PCB dhizaini ine imwe chete layer yemhangura yemateki uye zvikamu zvakaiswa kune rimwe divi rebhodhi.
Kuenzaniswa ne-multi-layer PCB, dhizaini yayo iri nyore uye iri nyore.
3. Ndezvipi zvakanakira single-layer FR4 PCB?
-Inodhura-inoshanda: Single-layer FR4 PCBs anowanzo kutengeka kana achienzaniswa neakawanda-layer mabhodhi.
-Kugadzira Kureruka: Izvo zviri nyore kugadzira sezvo zvichida maitiro mashoma akaomarara uye mashoma akaturikidzana.
-Inokodzera madhizaini akareruka: Iyo imwechete layer PCB inokwana kune yakapusa maapplication ayo asingade akakosha edunhu kuomarara kana miniaturization.
4. Ndezvipi zvinogumira pachikamu chimwe chete FR4 PCB?
-Inoganhurwa sarudzo dzenzira: Iine imwe chete layer yemhangura inoteedzera, nzira yeakaomesesa maseketi kana madhizaini ane yakakwira chikamu density inogona kunetsa.
-Kunyanya kukonzeresa ruzha uye kukanganiswa: Single-layer PCBs inogona kuve neakawanda chiratidzo chekuvimbika nyaya nekuda kwekushaikwa kwendege yepasi uye kuzviparadzanisa pakati peakasiyana masaini maratidziro.
-Kukura kwebhodhi saizi: Sezvo zvese zvinoteedzera, zvikamu, uye zvinongedzo zviri kune rimwe divi rebhodhi, single-layer FR4 PCBs inowanzova nehukuru hukuru kupfuura mabhodhi akawanda ane mashandiro akafanana.
5. Ndeapi marudzi ezvikumbiro akakodzera kune imwechete-layer FR4 PCB?
-Magetsi Emagetsi: Single-layer FR4 PCBs anowanzo shandiswa kune ekutanga emagetsi maseketi semagetsi emagetsi, mwenje we LED, uye yakaderera-density control masisitimu.
-Prototyping uye Hobbyist Projects: Single-layer FR4 PCBs dzakakurumbira pakati pevanofarira nekuda kwekugona kwavo uye dzinoshandiswa mune yekutanga prototyping nhanho isati yawedzera kune akawanda-layer dhizaini.
-Dzidzo uye Zvinangwa Zvekudzidza: Single layer PCBs anowanzo shandiswa muzvirongwa zvedzidzo kudzidzisa pfungwa dzakakosha dzemagetsi uye dhizaini yedunhu.
6. Pane here magadzirirwo anotariswa kune imwechete layer FR4 PCB?
-Kuiswa kwechikamu: Kushanda kwechikamu kuiswa kwakakosha kukwirisa nzira uye kuderedza kukanganiswa kwechiratidzo pane imwechete-layer PCB.
-Trace Routing: Kutsvaga nzira nekunyatso tarisisa kwechiratidzo chekuvimbika, kudzivirira masaini-masaini, uye kudzikisa kureba kwekutevera kunobatsira kuchengetedza kuita kwakavimbika.
- Grounding uye Power Distribution: Yakakwana ivhu uye kugovera magetsi kwakakosha kudzivirira matambudziko eruzha uye kuve nechokwadi chekushanda kwakakodzera kwedunhu.
